5AGXBA5D4F27I5N

IC FPGA 336 I/O 672FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 336 13284352 190000 672-BBGA, FCBGA

Quantity 923 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BBGA, FCBGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8962Number of Logic Elements/Cells190000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits13284352

Overview of 5AGXBA5D4F27I5N – Arria V GX FPGA, 336 I/O, 190000 logic elements

The 5AGXBA5D4F27I5N is an Arria V GX Field Programmable Gate Array (FPGA) IC in a 672-ball FCBGA package. It provides a high-density programmable logic fabric with industrial-grade qualification and a surface-mount package for system-level integration.

This device integrates a large logic capacity, substantial on-chip RAM, and a generous I/O count while operating across a defined core supply range and extended industrial temperature range, making it suitable for demanding electronic systems requiring programmable logic resources.

Key Features

  • Logic Capacity — 190,000 logic elements, providing extensive programmable logic resources for complex designs.
  • Logic Blocks — 8,962 logic blocks reported for fabric partitioning and resource planning.
  • On-Chip Memory — 13,284,352 total RAM bits for embedded storage, buffers, and state machines.
  • I/O Resources — 336 user I/O pins to support a wide range of peripheral interfaces and board-level connections.
  • Package & Mounting — 672-BBGA (672-FBGA, 27×27) package, surface-mount assembly for compact PCB integration.
  • Power — Core voltage supply range specified at 1.07 V to 1.13 V for design power budgeting.
  • Operating Temperature — Industrial grade operation from −40 °C to 100 °C for extended environmental tolerance.
  • Compliance — RoHS compliant.

Unique Advantages

  • High programmable density: 190,000 logic elements enable implementation of large-scale custom logic and complex datapaths without external PLD arrays.
  • Substantial embedded RAM: Over 13 million RAM bits reduce dependence on external memory for many buffering and temporary-storage tasks.
  • Robust I/O capacity: 336 I/O pins support multiple interfaces and high pin-count connectivity on a single device.
  • Industrial temperature rating: Specified −40 °C to 100 °C operation supports deployment in temperature-challenging environments.
  • Compact, standard BGA package: 672-ball FCBGA (27×27) enables dense PCB layouts while keeping the FPGA in a manufacturable surface-mount form factor.
  • Tightly specified core supply: Narrow 1.07 V–1.13 V supply window simplifies power-supply planning for stable core operation.

Why Choose 5AGXBA5D4F27I5N?

The 5AGXBA5D4F27I5N Arria V GX FPGA combines large logic capacity, significant on-chip RAM, and a high I/O count in a single industrial-grade, surface-mount FCBGA package. Its specifications make it suitable for designs that require dense programmable logic, integrated memory resources, and robust thermal tolerance.

For engineering teams and procurement focused on scalable programmable solutions, this device offers clearly defined electrical and mechanical parameters—core voltage range, operating temperature, package type, and resource counts—helping accelerate integration and system-level reliability planning.

Request a quote or submit an inquiry to receive pricing and availability information for 5AGXBA5D4F27I5N. Our team can assist with lead-time estimates and procurement details.

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