UCM1V331MNS1GS

The UCM1V331MNS1GS is a chip-type aluminum electrolytic capacitor in a compact surface-mount can, offering 330 µF nominal capacitance at a 35 V rating. It is designed for automated PCB assembly (embossed carrier taping) and includes features targeted at demanding electronic environments.

Key attributes include a wide operating temperature range (−55°C to +105°C), AEC-Q200 qualification, and vibration resistance, positioning the part for use in reliability-focused applications such as automotive and industrial electronics.

Key Features

• Capacitance & Voltage — 330 µF nominal capacitance with a rated voltage of 35 V and ±20% tolerance (measured at 120 Hz, 20°C).
• Low Loss / Low Impedance — Tangent of loss angle (tan δ) 0.12 (max.) at 35 V, measured at 20°C and 120 Hz, suited for applications requiring reduced ESR-related losses.
• Ripple Current Capability — Low-frequency ripple current 425 mA (120 Hz) and high-frequency ripple current 850 mA (10 kHz), supporting both low- and high-frequency decoupling tasks.
• Leakage Current — Specified leakage current of 115.5 µA (after 2 minutes’ application of rated voltage at 20°C), enabling predictable standby behavior.
• Temperature & Endurance — Operates from −55°C to +105°C with a rated endurance of 2000 hours at 105°C (for φD ≤ 10 mm), supporting high-temperature duty cycles.
• Package & Mounting — Chip-type radial can for surface-mount assembly (φ8×10L; L: 1.0 cm × D: 0.8 cm) with a recommended land size of 8.3 × 8.3 mm; supplied in embossed carrier tape for automated placement.
• Reliability & Compliance — AEC-Q200 qualified and RoHS compliant; designed to resist vibration for mechanically robust installations.

Typical Applications

• Automotive electronics — AEC-Q200 qualification and −55°C to +105°C operating range make it suitable for vehicle electronic modules that require reliable capacitive energy storage.
• Surface-mount power assemblies — Chip-type can and embossed carrier taping support automated placement in compact power and control boards.
• Vibration-prone systems — Vibration-resistant construction and specified endurance at 105°C support use in environments with mechanical stress.

Unique Advantages

• AEC-Q200 Qualification: Enables use in applications with automotive-grade reliability requirements.
• Compact High Capacitance: 330 µF in a φ8×10L SMD can provides significant capacitance in a small footprint for space-constrained designs.
• Broad Temperature Endurance: −55°C to +105°C range with 2000-hour endurance at 105°C supports long-term operation under elevated temperatures.
• Dual-Frequency Ripple Performance: Specified ripple current values for both 120 Hz (425 mA) and 10 kHz (850 mA) cover a range of power and decoupling needs.
• Automated Assembly Ready: Supplied in embossed carrier taping to streamline high-volume pick-and-place integration.
• Predictable Leakage Behavior: Specified leakage current (115.5 µA) after standard voltage application supports predictable power management design.

Why Choose UCM1V331MNS1GS?

UCM1V331MNS1GS combines a high-capacitance, low-impedance chip package with automotive-grade qualification and robust thermal endurance. Its combination of 330 µF capacitance, 35 V rating, and dual-frequency ripple current specifications provides designers with a reliable option for board-level energy storage and decoupling in demanding environments.

This capacitor is well suited to engineers designing systems that require compact SMD capacitors capable of withstanding wide temperature swings, vibration, and long-duration elevated-temperature operation—backed by RoHS compliance and AEC-Q200 qualification for regulated and reliability-sensitive applications.

To request a quote or discuss availability and pricing for UCM1V331MNS1GS, please contact our sales team or submit an inquiry through your preferred purchasing channel.