UCM1V561MNL1GS

The UCM1V561MNL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount assembly. It provides 560 µF capacitance at a 35 V rating and is supplied in embossed carrier taping for automatic mounting.

Engineered for applications that require operation across a wide temperature range and industry qualification, this part supports operation from -55°C to +105°C and carries AEC-Q200 qualification for demanding environments.

Key Features

• Capacitance & Voltage: 560 µF nominal capacitance with a 35 V rated voltage and ±20% tolerance, offering bulk energy storage for power circuits.
• Low Impedance Design: Chip-type, low-impedance construction to support ripple current handling and stable performance across frequency.
• Ripple Current Performance: Rated low-frequency ripple current of 595 mA at 120 Hz and high-frequency ripple current of 1.19 A at 10 kHz, enabling effective smoothing and decoupling in power stages.
• Leakage & Polarization: Polarized aluminum electrolytic capacitor with a specified leakage current of 196 µA.
• Temperature & Endurance: Operates from -55°C to +105°C with endurance specified at 2000 hours at 105°C (for diameter φD ≤ 10).
• Package & Assembly: φ10 × 10L radial can SMD package, surface-mount land size 10.3 mm × 10.3 mm, supplied in embossed carrier tape for automatic placement.
• Qualification & Compliance: AEC-Q200 qualified and RoHS compliant for regulated manufacturing environments.

Typical Applications

• Automotive Electronics — AEC-Q200 qualification and a -55°C to +105°C operating range make this capacitor suitable for electronic modules in automotive systems.
• Power Supply Filtering — 560 µF capacitance combined with 595 mA (120 Hz) and 1.19 A (10 kHz) ripple ratings supports smoothing and decoupling in DC power rails.
• Surface-Mount Assemblies — Chip-type SMD package and embossed carrier taping enable automated placement for high-volume manufacturing.
• High-Temperature Environments — Specified endurance of 2000 hours at 105°C for components with φD ≤ 10 supports designs exposed to elevated ambient temperatures.

Unique Advantages

• High Capacitance in a Chip Package: 560 µF in a φ10 × 10L SMD can provides substantial bulk capacitance while remaining compatible with automated surface-mount production.
• Designed for Ripple Stress: Dual ripple current ratings (low and high frequency) let designers evaluate performance across the relevant frequency spectrum for power electronics.
• Wide Temperature Capability: Rated from -55°C to +105°C, enabling deployment in environments with broad thermal ranges.
• AEC-Q200 Qualification: Industry qualification for demanding applications helps streamline selection for systems requiring validated component reliability.
• Manufacturing-Friendly Packaging: Embossed carrier taping supports automatic mounting machines to accelerate board assembly and reduce handling.
• Regulatory Compliance: RoHS compliance supports use in regulated production flows.

Why Choose UCM1V561MNL1GS?

UCM1V561MNL1GS combines high bulk capacitance and low-impedance chip construction in a surface-mount can tailored for automated assembly. Its ripple current capability, specified leakage current, and temperature/endurance ratings make it a practical choice for power filtering and energy storage in demanding applications.

This part is positioned for engineers and procurement teams seeking a robust, AEC-Q200-qualified aluminum electrolytic solution for designs that require verified thermal endurance, automated assembly compatibility, and regulatory compliance.

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