UCM1V470MCL1GS
| Part Description |
47 µF 35 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,919 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UCM |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 47 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 6.1 mm | HTS Code | 8532.22.0020 | ||
| Impedance | 360 mOhm | Lead Spacing | N/A | Lifetime @ Temp | 2000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 240 mA @ 10 kHz | Ripple Current Low Frequency | 120 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.8 x 5 mm | Surface Mount Land Size | 5.3 x 5.3 mm | ||
| Tolerance | -20%~20% | Voltage | 35 V |
Overview of UCM1V470MCL1GS – Chip‑Type Low‑Impedance Aluminum Electrolytic Capacitor, 47 µF / 35 V
The UCM1V470MCL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface‑mount assembly. Built for compact power and decoupling applications, it delivers 47 µF capacitance at a 35 V rating with specifications targeted for robust operation up to 105 °C.
Engineered for automated production and long‑term operation, this Nichicon part is offered in embossed carrier tape for pick‑and‑place and is AEC‑Q200 qualified for applications requiring enhanced reliability.
Key Features
- Capacitance & Tolerance — 47 µF nominal capacitance with ±20% tolerance measured at 120 Hz, 20 °C.
- Voltage Rating — Rated for 35 V operation suitable for mid‑voltage power rails.
- Low Impedance Performance — Specified impedance of 360 mΩ and a tan δ of 0.12 (120 Hz, 20 °C) to support effective AC filtering and decoupling.
- Ripple Current Capability — Low‑frequency ripple current of 120 mA (120 Hz) and high‑frequency ripple current of 240 mA (10 kHz) for handling dynamic load conditions.
- Leakage Current — Leakage current specified at 16.45 µA (after 2 minutes at rated voltage, 20 °C), supporting predictable standby and bias behavior.
- Thermal & Lifetime Ratings — Operating range from −55 °C to 105 °C with endurance tested to 2000 hours at 105 °C.
- Compact SMD Package — Chip can package with dimensions φ5 × 5.8 mm (L × D) and recommended land size 5.3 × 5.3 mm for space‑constrained PCBs.
- Assembly‑Ready Packaging — Supplied in embossed carrier taping for compatibility with automatic pick‑and‑place machines.
- Industry Qualification — AEC‑Q200 qualified and RoHS compliant, addressing rigorous reliability and environmental requirements.
Typical Applications
- Automotive Electronics — Suitable for board‑level power decoupling and smoothing in control modules and subsystems where AEC‑Q200 qualification is required.
- Power Supply Filtering — Use on DC‑DC converter outputs and intermediate rails to reduce ripple and stabilize regulated voltages.
- Embedded Systems — Local energy storage and transient suppression on compact SMD PCBs for industrial and consumer electronics.
Unique Advantages
- Automotive‑grade Qualification: AEC‑Q200 status provides documented qualification for demanding environments and reliability expectations.
- Low Impedance, Measurable Performance: 360 mΩ impedance and defined tan δ support predictable AC behavior for filtering and decoupling design tradeoffs.
- High Ripple Handling Relative to Size: Specified low‑ and high‑frequency ripple current ratings (120 mA / 240 mA) enable effective use in compact power stages.
- Compact SMD Footprint: φ5 × 5.8 mm can‑type SMD package and 5.3 × 5.3 mm recommended land pattern save PCB area in dense layouts.
- Wide Temperature & Endurance Window: −55 °C to 105 °C operating range with 2000 hours endurance at 105 °C supports long‑term reliability in elevated temperatures.
- Assembly‑Friendly Supply: Embossed carrier taping enables efficient automated placement and inventory handling in production lines.
Why Choose UCM1V470MCL1GS?
UCM1V470MCL1GS combines compact SMD packaging with low‑impedance electrical characteristics and AEC‑Q200 qualification to address space‑constrained, reliability‑focused designs. Its defined ripple current, leakage, and tan δ values make performance tradeoffs transparent for engineering and procurement decisions.
This Nichicon mass‑production part is suited for designers needing a proven 47 µF, 35 V SMD aluminum electrolytic solution for automotive and industrial power circuits where temperature endurance and automated assembly are priorities.
If you would like pricing, lead‑time, or availability information for UCM1V470MCL1GS, request a quote or contact sales to discuss your volume and delivery requirements.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016