UUP1HR33MCL1GS

The UUP1HR33MCL1GS is a chip‑type, bi‑polarized aluminum electrolytic capacitor designed for surface mounting on high‑density PC boards. It delivers a 330 nF capacitance at a 50 V rating with a wide operating temperature range and attributes aimed at reliable, automated production and demanding environments.

Key value propositions include bi‑polar operation for AC or non‑polar applications, an extended temperature range of −55 °C to +105 °C, RoHS compliance, and AEC‑Q200 qualification for applications that require automotive‑grade reliability.

Key Features

• Bi‑Polar Chip Construction Bi‑polarized aluminum electrolytic design suitable for circuits that require non‑polar capacitance behavior.
• Electrical Specification 330 nF rated capacitance with a 50 V rating and tolerance of −20% to +20% (measured at 120 Hz, 20 °C).
• Wide Temperature & Endurance Rated for −55 °C to +105 °C and specified for 1000 hours at 105 °C with polarity cycling during the endurance test.
• Ripple Current Performance Specified ripple current values include 2.8 mA at 120 Hz and 4.2 mA at 10 kHz; frequency coefficients apply per the series datasheet.
• Surface‑Mount, High‑Density Package Chip‑type radial can SMD package with board footprint recommendation L: 4.3 × W: 4.3 mm and part dimensions L: 5.8 × D: 4 mm for compact PCB layouts.
• Automated Assembly Ready Designed for mounting by automatic placement equipment and compatible with carrier tape feed for high‑volume production.
• Compliance & Qualification RoHS compliant and AEC‑Q200 qualified, supporting applications that require recognized reliability standards.

Typical Applications

• Automotive Electronics — Suitable for automotive electronic modules where AEC‑Q200 qualification and operation to +105 °C are required.
• High‑Density PCB Assemblies — Compact chip package and SMD mounting make it well suited for dense board layouts and space‑constrained designs.
• Automated Manufacturing — Carrier tape compatibility and surface‑mount form factor streamline placement and throughput on automated assembly lines.
• Bi‑Polar/AC Coupling Circuits — Bi‑polar construction enables use in circuits that require non‑polar capacitor behavior.

Unique Advantages

• Automotive‑Grade Reliability: AEC‑Q200 qualification provides documented qualification for designs targeting automotive applications.
• High‑Temperature Endurance: Specified for 1000 hours at 105 °C, enabling stable performance in elevated temperature environments.
• Compact SMD Footprint: Small chip dimensions and a recommended land size (4.3 × 4.3 mm) reduce board real estate and support high‑density layouts.
• Production‑Friendly Packaging: Carrier tape feed compatibility simplifies pick‑and‑place integration for automated assembly lines.
• Regulatory Compliance: RoHS compliance supports use in regions and products requiring restricted substance compliance.

Why Choose UUP1HR33MCL1GS?

The UUP1HR33MCL1GS combines bi‑polarized aluminum electrolytic performance with an SMD chip package engineered for high‑density boards and automated assembly. Its 330 nF/50 V rating, broad −55 °C to +105 °C range, and 1000‑hour endurance at 105 °C make it a reliable choice for designs requiring temperature resilience and long‑term stability.

This part is particularly appropriate for designers specifying components for automotive and other demanding environments where AEC‑Q200 qualification, RoHS compliance, compact size, and automated assembly readiness are priorities.

If you would like pricing, availability, or a formal quote for UUP1HR33MCL1GS, please submit a quote request or inquiry and our team will respond with the information you need.