UUP1V100MCL1GS

The UUP1V100MCL1GS is a chip-type, bi-polar aluminum electrolytic capacitor in a compact surface-mount can designed for high-temperature environments. It delivers 10 µF capacitance at a 35 V rating and is targeted at electronics requiring robust thermal endurance and board-level integration.

Engineered for surface mounting on high-density PC boards, this part is suitable for automated assembly (carrier-tape fed) and meets industry environmental and reliability standards including RoHS compliance and AEC-Q200 qualification.

Key Features

• Electrical Performance — 10 µF nominal capacitance with a rated voltage of 35 V and capacitance tolerance of ±20% (−20% to +20%).
• Bi‑Polar Design — Bi-polarized construction suitable where non-polar or bipolar capacitor behavior is required.
• High-Temperature Endurance — Rated for operation from −55 °C to +105 °C with a specified lifetime of 1000 hours at 105 °C (voltage applied, polarity reversed every 250 hours).
• Ripple Handling — Specified ripple currents of 29 mA at 120 Hz and 43.5 mA at 10 kHz; frequency coefficients provided in the series datasheet support design for varying ripple frequencies.
• Surface-Mount Package — Chip-style radial can in an SMD package sized L: 5.8 × D: 6.3 mm with a recommended land size of 6.6 × 6.6 mm for PCB footprint design.
• Automated Assembly Compatible — Designed for use with automatic mounting machines and carrier tape feed.
• Standards & Compliance — AEC-Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive electronic modules — For use in vehicle electronics where AEC-Q200 qualification and high-temperature endurance are required.
• High-density PCB designs — Surface-mount chip form factor enables compact placement on densely populated boards and automated assembly lines.
• Power and signal conditioning — Bi-polar capacitor option for AC coupling and decoupling in systems operating across a wide temperature range.

Unique Advantages

• High-temperature reliability: Specified operation to +105 °C and 1000 hours endurance at that temperature provide predictable performance in hot environments.
• AEC-Q200 qualification: Provides an industry-recognized reliability baseline for applications needing automotive-grade components.
• Compact SMD can: Small 5.8 × 6.3 mm footprint with defined land pattern (6.6 × 6.6 mm) simplifies layout and enables high-density board designs.
• Bi-polar construction: Eliminates polarity constraints for AC-coupling and bipolar applications, offering greater design flexibility.
• Assembly-friendly packaging: Carrier-tape feed compatibility supports high-volume, automated pick-and-place assembly processes.
• Regulatory compliance: RoHS compliance supports designs that must meet modern environmental regulations.

Why Choose UUP1V100MCL1GS?

The UUP1V100MCL1GS combines a compact chip-style surface-mount package with bi-polar aluminum electrolytic performance tailored for high-temperature, reliability-focused designs. Its 35 V rating, 10 µF capacitance, and AEC-Q200 qualification make it a suitable choice where thermal endurance, automated assembly compatibility, and environmental compliance are core requirements.

This part is well suited to engineers and procurement teams designing robust automotive and industrial electronics that demand predictable endurance and straightforward PCB integration, while also benefiting from carrier-tape assembly and RoHS compliance.

Request a quote or contact sales to discuss availability, volume pricing, and to submit a procurement inquiry for UUP1V100MCL1GS.