UUP1V2R2MCL1GS

CAP ALUM BP 2.2UF ±20% 35V SMD
Part Description

2.2 µF 35 V ±20% Bi-Polar Aluminum Electrolytic Capacitor, SMD

Quantity 754 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUUP
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotiveCapacitance2.2 µFECCNEAR99
ESRN/AHeight Seated (Max)6.1 mmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp1000 h @ 105°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-55°C - 105°C
Package / CaseRadial, Can - SMDPolarizationBi-PolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency12.6 mA @ 10 kHzRipple Current Low Frequency8.4 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension5.8 x 4 mmSurface Mount Land Size4.3 x 4.3 mm
Tolerance-20%~20%Voltage35 V

Overview of UUP1V2R2MCL1GS – 2.2 µF, 35 V Bi-Polar Aluminum Electrolytic SMD Capacitor

The UUP1V2R2MCL1GS from Nichicon is a chip-type, bi-polarized aluminum electrolytic capacitor engineered for surface-mount use on high-density printed circuit boards. It delivers 2.2 µF capacitance at a 35 V rating with a compact 5.8 × 4.0 mm footprint and is designed for automated tape-and-reel placement.

With an operating temperature range of −55 °C to +105 °C, AEC-Q200 qualification, and RoHS compliance, this part targets robust electronics that require reliable performance in demanding thermal and mechanical assembly environments.

Key Features

  • Electrical Performance — 2.2 µF capacitance at 35 V with ±20% tolerance and bi‑polarized construction.
  • Temperature Range & Endurance — Rated for −55 °C to +105 °C with an endurance specification of 1000 hours at 105 °C under rated voltage conditions.
  • Ripple Current Capability — Specified ripple current of 8.4 mA at 120 Hz and 12.6 mA at 10 kHz; frequency coefficients provided (120 Hz = 1.00, 10 kHz or more = 1.50) for sizing across frequency bands.
  • Surface-Mount Chip Package — Chip-type SMD in a radial can-style package with dimensions L: 5.8 × D: 4.0 mm and recommended land pattern L: 4.3 × W: 4.3 mm for compact PCB layouts.
  • Assembly-Compatible — Designed for surface mounting on high-density PC boards and applicable to automatic mounting machines fed with carrier tape.
  • Standards & Compliance — AEC-Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

  • Automotive Electronics — Use in automotive modules that require AEC‑Q200 qualified passives and reliable operation up to +105 °C.
  • Compact Power Modules — Suited for space-constrained, high-density PCB designs where a small SMD capacitor is needed for decoupling or filtering.
  • High‑Temperature Electronics — Applicable where components must tolerate extended operation at elevated temperatures, supported by the 1000-hour endurance at 105 °C.

Unique Advantages

  • AEC‑Q200 Qualification: Provides confidence for designs that require automotive-grade component qualification and traceable reliability.
  • Wide Operating Temperature: −55 °C to +105 °C rating supports deployment across a broad range of thermal environments.
  • SMD Chip Form Factor: Small 5.8 × 4.0 mm footprint and defined land pattern enable high-density PCB layout and automated assembly.
  • Bi‑Polarized Construction: Eliminates polarity constraints inherent to polar capacitors, accommodating circuit designs that experience polarity variation.
  • Frequency-Aware Ripple Data: Provided ripple current values and frequency coefficients make it straightforward to size the capacitor for specific AC and switching frequencies.
  • RoHS Compliant: Meets regulatory requirements for restricted substances in electronics assemblies.

Why Choose UUP1V2R2MCL1GS?

The UUP1V2R2MCL1GS combines a compact SMD chip package with bi‑polarized aluminum electrolytic construction and documented ripple, temperature, and endurance characteristics. Its AEC‑Q200 qualification and RoHS compliance make it a practical choice for engineers designing robust, high-density systems that must perform reliably in elevated-temperature environments.

This part is ideal for design teams and procurement sourcing components for automotive modules, compact power stages, and other applications where space, automated assembly compatibility, and validated thermal endurance are priorities.

For pricing or to request a quote for UUP1V2R2MCL1GS, please submit your requirements and our team will respond with availability and lead-time information.

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    Date Founded: 1950


    Headquarters: Nakagyo, Kyoto, Japan


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