UUT0G220MCL1GS

The UUT0G220MCL1GS from Nichicon is a chip-type aluminum electrolytic capacitor engineered for surface-mount use on high-density printed circuit boards. With a rated capacitance of 22 µF at 4 V, this part is built for compact SMD assemblies and automated placement via carrier tape.

Key value propositions include a long load life (2000 hours at +105 °C), AEC-Q200 qualification for demanding applications, and RoHS compliance. Its combination of compact size and verified endurance makes it suitable for applications where space, temperature resilience, and automated assembly are priorities.

Key Features

• Capacitance & Rated Voltage 22 µF nominal capacitance with a rated voltage of 4 V and ±20% tolerance (120 Hz, 20 °C).
• Wide Operating Temperature Specified operating range from -55 °C to +105 °C to support temperature-extensive environments.
• Extended Load Life Load life rated at 2000 hours at +105 °C; endurance cap change for ≤16 V parts is within ±25% after the specified life.
• AEC-Q200 Qualification & RoHS Compliance AEC-Q200 rating and compliance with the RoHS directive (2011/65/EU, (EU)2015/863) for regulated markets.
• Compact SMD Chip Package Chip-type radial can SMD package with overall dimensions L: 5.8 × D: 4 mm and recommended land size L: 4.3 × W: 4.3 mm.
• Assembly-Ready Designed for surface mounting on high-density PCBs and compatible with automatic mounting machines fed by carrier tape.
• Ripple and Loss Characteristics Rated ripple current: 22 mA at 120 Hz and 33 mA at 10 kHz; tan δ (max.) at 4 V is 0.37 (measured at 120 Hz, 20 °C).
• Leakage Current Control Leakage current after 2 minutes at rated voltage and 20 °C is ≤ 0.01 CV or 3 µA, whichever is greater.

Typical Applications

• Automotive Electronics — Components and modules in automotive systems that require AEC-Q200‑rated, surface-mount aluminum electrolytic capacitance.
• High-density PC Board Designs — Compact SMD chip format tailored for densely populated boards where board space and automated placement are critical.
• Automated Assembly Lines — Carrier-tape compatible packaging for reliable pick-and-place and reflow-line integration.

Unique Advantages

• Proven High-temperature Endurance: 2000‑hour load life at +105 °C provides predictable aging behavior and specification-backed longevity for thermal stress conditions.
• Automotive-grade Reliability: AEC-Q200 rating aligns the component with automotive-grade qualification processes for use in regulated applications.
• Compact Footprint: Small L: 5.8 × D: 4 mm package and defined land pattern enable dense PCB layouts without sacrificing electrolytic capacitance.
• Assembly Efficiency: Designed for carrier-tape automatic mounting to streamline high-volume production and reduce handling time.
• Controlled Electrical Performance: Specified ripple current, low leakage current limits, and measured tan δ provide quantifiable electrical behavior for power and decoupling design decisions.

Why Choose UUT0G220MCL1GS?

UUT0G220MCL1GS positions itself as a compact, surface-mount aluminum electrolytic solution for applications that require verified thermal endurance and automotive-grade qualification. Its combination of a small chip package, tape-feed compatibility, and defined electrical characteristics makes it suitable for engineers designing dense PCBs and modules where space and reliability matter.

Supported by Nichicon’s UUT series specifications—covering operating temperatures, leakage, ripple current, and endurance—this capacitor provides a quantifiable component choice for engineers balancing size, assembly efficiency, and long-term performance.

Request a quote or contact sales to discuss availability, pricing, and how UUT0G220MCL1GS can fit into your assembly and qualification plans.