UUT0G470MCL1GS

The UUT0G470MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface-mount assembly on high-density PC boards. It delivers 47 µF capacitance at a 4 V rating with AEC‑Q200 qualification and a wide operating temperature range, targeting demanding automotive electronic applications.

Built for automated production, this part is compatible with carrier-tape feeding and offers long-term thermal endurance with a load life rating specified at elevated temperature.

Key Features

• Capacitance & Voltage: 47 µF nominal capacitance with a 4 V rated voltage and ±20% tolerance for predictable bulk and decoupling behaviour.
• High Temperature Endurance: Load life specified as 2000 hours at +105 °C, providing defined performance after prolonged thermal stress.
• Wide Operating Temperature: Rated for −55 °C to +105 °C operation to support electronics across broad ambient conditions.
• Package & Mounting: Chip-type radial can designed for surface mounting; specified surface-mount land size 5.3 × 5.3 mm to support PCB layout and automated assembly.
• Ripple Current Capability: Specified ripple current of 36 mA at 120 Hz and 54 mA at 10 kHz suitable for typical low-voltage ripple environments.
• Standards & Compliance: AEC‑Q200 compliant and RoHS (2011/65/EU, (EU)2015/863) compliant.

Typical Applications

• Automotive electronics modules — suited for electronic control units that require components meeting AEC‑Q200 and wide temperature operation.
• Embedded power circuits — applicable where a compact SMD aluminum electrolytic capacitor is needed for local energy storage and smoothing at low voltages.
• Automated manufacturing flows — compatible with carrier-tape fed pick-and-place for high-volume assembly processes.

Unique Advantages

• AEC‑Q200 reliability: Explicit AEC‑Q200 rating supports use in automotive-grade designs requiring qualified components.
• Long thermal load life: 2000 hours at +105 °C gives designers a clear endurance specification for high-temperature applications.
• Compact SMD chip form: Chip-type radial can and defined land pattern (5.3 × 5.3 mm) help conserve PCB area while enabling automated placement.
• Wide temperature range: −55 °C to +105 °C rating ensures stable performance across harsh thermal environments.
• RoHS compliant: Conforms to RoHS directive (2011/65/EU, (EU)2015/863) for environmental compliance in modern assemblies.

Why Choose UUT0G470MCL1GS?

The UUT0G470MCL1GS combines an automotive-grade qualification with defined high-temperature endurance and an SMD chip package engineered for automated assembly. Its 47 µF/4 V electrical profile and specified ripple current figures make it suitable for low-voltage power smoothing and decoupling in systems that must operate across −55 °C to +105 °C.

This part is appropriate for design teams focusing on reliability and predictable long-term performance in automotive and other demanding embedded applications where AEC‑Q200 compliance and RoHS status are required.

If you need pricing, lead-time details, or a formal quote for UUT0G470MCL1GS, please submit a parts inquiry or request a quote to our sales team and we will respond with availability and order options.