UUT0J330MCL1GS

The UUT0J330MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface mounting on high-density printed circuit boards. It delivers 33 µF at a rated voltage of 6.3 V in a compact SMD can package, and is engineered for applications that require wide operating temperatures and long load life.

Key value comes from a wide operating temperature range (−55 °C to +105 °C), a rated load life of 2000 hours at +105 °C, and compliance with AEC-Q200 and RoHS, making it suitable for automotive and other demanding surface-mount applications.

Key Features

• Capacitance & Voltage — 33 µF capacitance at a rated voltage of 6.3 V with ±20% tolerance (at 120 Hz, 20 °C).
• Chip SMD Package — Chip-type radial can for surface mounting; package dimensions L: 5.8 × D: 5 mm with recommended land size L: 5.3 × W: 5.3 mm.
• Wide Temperature Range — Rated for operation from −55 °C to +105 °C.
• Long Load Life — Load life of 2000 hours at +105 °C with specified endurance characteristics (capacitance change within ±25% for 16 V or less after endurance test).
• Ripple & Leakage — Ripple current ratings of 30 mA at 120 Hz and 45 mA at 10 kHz; leakage current after 2 minutes at rated voltage and 20 °C is not more than 0.01 CV or 3 µA, whichever is greater.
• Soldering Reliability — Meets resistance-to-soldering-heat criteria (hot plate at 250 °C for 30 seconds) with capacitance change within ±10% after recovery to 20 °C.
• Manufacturing Compatibility — Designed for surface mounting on high-density PC boards and applicable to automatic mounting machines using carrier tape.
• Standards & Compliance — AEC-Q200 compliant and RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive equipment — Suitable for automotive electronic modules where AEC-Q200 compliance and operation to +105 °C are required.
• High-density surface-mount PCBs — Chip-type design intended for use on dense board layouts and compatible with carrier-tape automated mounting.
• Temperature-critical systems — Applications requiring reliable performance across −55 °C to +105 °C and extended load life at elevated temperature.

Unique Advantages

• Automotive-grade qualification: AEC-Q200 compliance supports use in automotive electronics projects that require component-level automotive screening.
• Wide operating envelope: −55 °C to +105 °C rating provides thermal headroom for demanding environments.
• Proven endurance: Rated for 2000 hours at +105 °C, delivering predictable aging and performance over long elevated-temperature exposure.
• Compact SMD footprint: 5.8 × 5 mm package and 5.3 × 5.3 mm recommended land pattern enable placement in space-constrained designs.
• Manufacturing-ready: Designed for automatic mounting with carrier tape, easing integration into high-volume assembly flows.
• Low leakage behavior: Leakage current specified as not more than 0.01 CV or 3 µA after initial application of rated voltage, supporting low-standby-loss designs.

Why Choose UUT0J330MCL1GS?

The UUT0J330MCL1GS combines a compact chip SMD package with a proven aluminum electrolytic construction to meet the thermal and lifetime demands of automotive and other temperature-challenged designs. Its 33 µF/6.3 V rating, long load life at +105 °C, and explicit AEC-Q200 and RoHS compliance make it a reliable choice where space, temperature tolerance, and manufacturability are key considerations.

This part is well suited to engineers specifying components for dense, thermally stressed boards that require documented endurance, controlled leakage, and compatibility with automated assembly processes.

If you would like pricing, lead-time information, or to request a quote for UUT0J330MCL1GS, please submit a quote request or contact sales for assistance.