UUT0G330MCL1GS

The UUT0G330MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface mounting on high-density printed circuit boards. It delivers 33 µF capacitance at a 4 V rated voltage in a compact SMD can package (L: 5.8 × D: 5 mm) and is compatible with automated, carrier-tape placement.

Engineered for wide temperature operation (−55 °C to +105 °C) with a demonstrated load life of 2000 hours at +105 °C, this part is AEC‑Q200 rated and RoHS compliant. Note: this product is scheduled for discontinuation and is not recommended for new designs.

Key Features

• Capacitance & Voltage — 33 µF rated capacitance at 4 V provides bulk and decoupling capability in a compact chip form factor.
• Chip SMD Package — Radial, can-type SMD package designed for surface mounting on high-density PC boards; surface-mount land size 5.3 × 5.3 mm.
• Wide Temperature Range — Operational range from −55 °C to +105 °C for use across wide thermal environments.
• High-Temperature Load Life — Rated load life of 2000 hours at +105 °C, with defined endurance limits for capacitance change, tan δ, and leakage current.
• Ripple Current Performance — Specified ripple current: 30 mA at 120 Hz and 45 mA at 10 kHz for AC stress considerations.
• Electrical Characteristics — Capacitance tolerance ±20%; leakage current after 2 minutes at 20 °C is ≤ 0.01 CV or 3 µA (whichever is greater); tan δ (4 V) max 0.37 at 120 Hz, 20 °C.
• Assembly & Reliability — Applicable to automatic mounting machines fed with carrier tape; meets resistance-to-soldering-heat requirements (hot plate 250 °C, 30 s) and shelf-life criteria per datasheet.
• Compliance & Qualification — AEC‑Q200 compliant and RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — AEC‑Q200 rating makes this capacitor suitable for automotive electronic modules that require an SMD aluminum electrolytic solution.
• High-Density PCBs — Chip SMD form factor and compact footprint support power filtering where board area is constrained.
• Automated Assembly — Carrier-tape compatibility enables efficient placement on automated pick-and-place assembly lines.

Unique Advantages

• AEC‑Q200 Qualification: Enables use in automotive-grade systems that require components meeting AEC reliability standards.
• High-Temperature Endurance: 2000 hours at +105 °C provides defined performance margins for elevated-temperature applications.
• Compact Chip Design: Small L × D footprint (5.8 × 5 mm) and defined land pattern (5.3 × 5.3 mm) optimize board space and layout repeatability.
• Automated Assembly Ready: Designed for carrier-tape feeding to streamline high-volume manufacturing and placement accuracy.
• Measured Electrical Limits: Clear specs for leakage current, tan δ, and ripple current allow predictable integration into power and decoupling networks.
• Environmental Compliance: RoHS conformity supports regulatory requirements for lead-free assemblies.

Why Choose UUT0G330MCL1GS?

The UUT0G330MCL1GS offers a compact, automotive‑qualified aluminum electrolytic capacitor solution with defined endurance at elevated temperatures and clear electrical specifications for leakage, tan δ, and ripple current. Its chip SMD can package and carrier-tape compatibility make it practical for high-density boards and automated assembly processes.

This part is suited for designers and procurement teams managing legacy or repair-oriented projects where an AEC‑Q200 rated aluminum electrolytic SMD capacitor with proven high-temperature load life is required. The datasheet provides detailed endurance, soldering, and shelf-life criteria to support reliable integration and qualification efforts.

If you would like pricing, availability, or a quote for UUT0G330MCL1GS, please request a quote or contact sales to discuss current inventory and lead-time options.