UUT1H100MCL1GS

CAP ALUM 10UF ±20% 50V SMD
Part Description

10 µF 50 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 1,920 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUUT
ManufacturerNichicon
Manufacturing StatusEnd Of Life
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotiveCapacitance10 µFECCNEAR99
ESRN/AHeight Seated (Max)6.1 mmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp2000 h @ 105°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-55°C - 105°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency45 mA @ 10 kHzRipple Current Low Frequency30 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension5.8 x 6.3 mmSurface Mount Land Size6.6 x 6.6 mm
Tolerance-20%~20%Voltage50 V

Overview of UUT1H100MCL1GS – 6mmL Chip-Type Aluminum Electrolytic Capacitor (10 µF, 50 V)

The UUT1H100MCL1GS is a chip‑type aluminum electrolytic capacitor engineered for surface‑mount assemblies, providing 10 µF capacitance at a 50 V rating. Designed for high‑density PC boards and placement by automatic mounting equipment, it delivers a compact SMD can form factor for space‑constrained power and decoupling functions.

Built for robust thermal operation, this part offers a rated operating range from -55 °C to +105 °C with a specified load life of 2000 hours at +105 °C. The device is RoHS compliant and carries AEC‑Q200 recognition.

Key Features

  • Electrical Performance — 10 µF nominal capacitance with a 50 V rated voltage and ±20% tolerance; polarized device suitable for DC applications.
  • High‑temperature Endurance — Load life rated at 2000 hours at +105 °C, with specified limits for capacitance change, tan δ and leakage after endurance testing.
  • Ripple Current Capability — Specified ripple currents of 30 mA at 120 Hz and 45 mA at 10 kHz to support filtering and decoupling in low‑current SMD power circuits.
  • Leakage Current Specification — After 2 minutes at 20 °C, leakage current is ≤ 0.01 CV or 3 µA, whichever is greater.
  • Surface‑Mount, Tape‑Ready Package — Chip type radial can for SMD use; compatible with carrier tape for automatic mounting on high‑density PCBs. Surface mount land recommendation: 6.6 × 6.6 mm.
  • Compact Mechanical Size — Case footprint L: 5.8 × D: 6.3 mm with a seated height of 5.8 mm, enabling placement in compact board layouts.
  • Standards & Compliance — RoHS compliant and AEC‑Q200 recognized for elevated reliability requirements.

Typical Applications

  • Automotive electronics — Suited for surface‑mount use in automotive modules where an AEC‑Q200 recognized electrolytic capacitor is required.
  • High‑density PCBs — Designed for placement on compact, high‑component‑density boards using automated carrier tape feeding.
  • Surface‑mount power filtering — Compact SMD can for local decoupling and filtering in space‑constrained power supply sections.

Unique Advantages

  • AEC‑Q200 recognition: Provides a documented reliability baseline for applications requiring elevated component robustness.
  • High temperature load life: 2000 hours at +105 °C supports sustained operation in thermally demanding environments.
  • Tape‑feed compatible SMD form factor: Enables automated placement on high‑density PCBs to streamline assembly and reduce handling.
  • Compact footprint and defined land pattern: Small L × D dimensions and a 6.6 × 6.6 mm recommended land area simplify layout for tight designs.
  • Clear electrical limits: Specified leakage current and ripple current ratings allow predictable performance in low‑current filtering roles.
  • Regulatory compliance: RoHS conformity supports regulatory and environmental requirements for product designs.

Why Choose UUT1H100MCL1GS?

The UUT1H100MCL1GS positions itself as a compact, surface‑mount aluminum electrolytic solution for engineers needing a 10 µF/50 V capacitor with documented high‑temperature endurance and industry compliance. Its chip can packaging and compatibility with carrier‑tape automated assembly make it practical for tight board layouts and volume production processes.

This part is suitable for designers and procurement teams specifying components for robust, space‑efficient power filtering on high‑density PCBs, particularly where AEC‑Q200 recognition and RoHS compliance are required. Please note: this product is scheduled for discontinuation and is not recommended for new designs.

Request a quote or submit an inquiry for pricing and availability to receive lead‑time and ordering information for UUT1H100MCL1GS.

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    Date Founded: 1950


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