UUT1H3R3MCL1GS

The UUT1H3R3MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface-mount assembly on high-density PC boards. It offers a 3.3 µF capacitance at a 50 V rating in a compact radial can SMD package, targeting applications that require wide temperature capability and industry-level reliability.

Engineered for automated placement, this capacitor supports AEC-Q200-rated designs and complies with RoHS (2011/65/EU, (EU)2015/863), making it suitable for demanding electronic assemblies that require long-term stability across a broad temperature range.

Key Features

• Capacitance & Voltage — 3.3 µF nominal capacitance with a 50 V rated voltage and a tolerance of ±20% (−20% to +20%).
• Chip SMD Package — Radial, can-type surface-mount package sized L: 5.8 × D: 4 mm with recommended land size L: 4.3 × W: 4.3 mm, optimized for high-density board layouts and automatic mounting with carrier tape.
• Wide Operating Temperature — Rated for −55°C to +105°C operation, supporting designs that require broad temperature endurance.
• Designed Endurance — Load life specified as 2000 hours at +105°C, with defined limits for capacitance change, tan δ and leakage current after endurance testing.
• Leakage Current Specification — After 2 minutes’ application of rated voltage at 20°C, leakage current is specified as not more than 0.01 CV or 3 µA, whichever is greater.
• Ripple Current — Measured ripple current is 14 mA at 120 Hz and 21 mA at 10 kHz, suitable for low- to mid-frequency filtering in small-signal applications.
• Standards & Compliance — AEC-Q200 compliant and RoHS directive compliant, addressing reliability and environmental requirements for regulated markets.

Typical Applications

• Automotive Electronics — For control modules and electronic subsystems that require AEC-Q200 qualification, wide temperature operation, and surface-mount assembly.
• Power Conditioning on Compact PCBs — Useful where a small, polarized electrolytic is needed for decoupling or local energy storage on dense surface-mount boards.
• Automated Assembly Environments — Specifically suited to production lines using carrier-tape fed pick-and-place equipment for high-volume manufacturing.

Unique Advantages

• AEC-Q200 Compliance — Meets automotive-grade stress screening to support designs that require industry-recognized reliability standards.
• RoHS Conformant — Complies with RoHS directives (2011/65/EU, (EU)2015/863) for restricted substances in electronic assemblies.
• Compact, Board-Friendly Form Factor — Chip-type radial can SMD package with small footprint and specified land size for efficient placement on high-density PCBs.
• Long High-Temperature Endurance — Rated for 2000 hours at +105°C, providing predictable life characteristics under elevated temperature stress.
• Measured Ripple Performance — Documented ripple current values at both low and high frequencies to help size capacitors for filtering and decoupling tasks.
• Low Leakage — Leakage current defined by a clear CV-based limit, aiding the design of low-leakage power and timing circuits.

Why Choose UUT1H3R3MCL1GS?

UUT1H3R3MCL1GS positions itself as a compact, surface-mount aluminum electrolytic solution for applications that demand wide temperature capability, AEC-Q200 reliability, and compatibility with automated assembly. Its combination of a 3.3 µF capacitance at 50 V, 2000-hour endurance at +105°C, and documented ripple and leakage characteristics makes it appropriate for engineers specifying dependable polarized capacitors in constrained PCB real estate.

This part is suited for design teams and procurement focused on robust, production-ready electrolytic capacitors for automotive and industrial electronics where AEC-Q200 compliance, RoHS conformity, and automated placement are required.

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