UUT1V4R7MCL1GS

The UUT1V4R7MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface-mount use on high-density PC boards. It delivers 4.7 µF capacitance at a 35 V rating in a compact radial can SMD package (L: 5.8 × D: 4 mm).

Engineered for automotive and industrial electronics, this capacitor combines AEC‑Q200 compliance, wide temperature performance and carrier-tape compatibility for automated assembly, making it suitable for applications that require robust electrolytic bulk capacitance in a small footprint.

Key Features

• Electrical Performance — 4.7 µF nominal capacitance with ±20% tolerance and a 35 V rated voltage provides bulk capacitance for power-rail smoothing and energy storage.
• Temperature & Lifetime — Rated for operation from −55 °C to +105 °C with a specified load life of 2000 hours at +105 °C, supporting demanding thermal environments.
• Package & Footprint — Chip-type radial can SMD packaged at L: 5.8 × D: 4 mm with surface-mount land size L: 4.3 × W: 4.3 mm for compact PCB layouts.
• Assembly Compatibility — Designed for surface mounting on high-density PC boards and compatible with automatic mounting machines fed with carrier tape to streamline assembly.
• Reliability & Quality — AEC‑Q200 compliant and conforms to RoHS directives (2011/65/EU, (EU)2015/863), supporting regulated and quality-focused designs.
• Leakage & Loss Characteristics — Series-level leakage specification: after 2 minutes at 20 °C, leakage current is not more than 0.01 CV or 3 µA (whichever is greater); tan δ values and impedance characteristics follow the UUT series datasheet.
• Ripple Current — Specified ripple current performance includes 15 mA at 120 Hz and 22.5 mA at 10 kHz for typical AC stress conditions.

Typical Applications

• Automotive Electronics — Suitable for electronic control units and other vehicle systems where AEC‑Q200 compliance and wide temperature operation are required.
• High‑Density Surface‑Mount PCBs — Compact chip package supports space‑constrained board designs that require electrolytic capacitance.
• Automated Assembly Lines — Carrier-tape compatibility enables efficient placement with automatic mounting machines for volume production.

Unique Advantages

• Automotive-Grade Qualification: AEC‑Q200 compliance addresses the reliability expectations of automotive and similarly demanding markets.
• Wide Operating Temperature: −55 °C to +105 °C rating supports operation across extended environmental ranges.
• Long High‑Temperature Life: 2000 hours at +105 °C demonstrates endurance for thermal stress scenarios.
• Compact SMD Form Factor: Small L: 5.8 × D: 4 mm package and defined land pattern enable dense board placement without sacrificing capacitance.
• RoHS Compliance: Conforms to RoHS directive requirements for regulated designs and markets.
• Assembly-Ready Design: Carrier-tape compatibility simplifies integration into automated pick-and-place production flows.

Why Choose UUT1V4R7MCL1GS?

The UUT1V4R7MCL1GS balances compact packaging with robust electrolytic performance for applications that demand reliable bulk capacitance in constrained footprints. Its AEC‑Q200 conformity, wide temperature range and 2000‑hour life at +105 °C make it a strong fit for production-ready automotive and industrial designs that prioritize tested reliability and PCB density.

Choose this part when you need verified performance (leakage, tan δ, ripple current) in a carrier-tape-compatible SMD can for streamlined automated assembly and long-term field operation under elevated temperatures.

If you would like pricing, availability or a formal quote for UUT1V4R7MCL1GS, please request a quote or submit an inquiry to our sales team and include your required quantities and delivery timeframe.