UUT1H4R7MCL1GS

The UUT1H4R7MCL1GS is a chip-style aluminum electrolytic capacitor from Nichicon’s UUT series, built for surface-mount use on high-density printed circuit boards. This 4.7 μF, 50 V polarized capacitor provides a compact SMD can package intended for automated, carrier-tape fed assembly and high-temperature operation.

Key performance attributes include a wide operating temperature range of -55 °C to +105 °C, a rated load life of 2000 hours at +105 °C, and AEC-Q200 and RoHS compliance. Note: this product is scheduled to be discontinued and is not recommended for new designs.

Key Features

• Capacitance & Voltage — 4.7 μF rated capacitance with a 50 V rated voltage and tolerance of ±20% (at 120 Hz, 20 °C).
• Chip-style Aluminum Electrolytic — Chip-type construction designed for compact surface-mount use on high-density PCBs.
• Temperature & Lifetime — Rated for -55 °C to +105 °C operating temperature and a load life of 2000 hours at +105 °C; endurance specified for capacitance and leakage after life test.
• Package & Footprint — Radial can SMD package with part dimensions L: 5.8 × D: 5.0 mm and recommended land size L: 5.3 × W: 5.3 mm.
• Assembly Ready — Applicable to automatic mounting machines fed with carrier tape; designed for surface mounting and high-density board assembly.
• Reliability & Compliance — AEC-Q200 compliant and RoHS (2011/65/EU, (EU)2015/863) compliant for regulated environments.
• Polarized — Electrolytic (polar) construction; observe polarity in application.
• Ripple Current Ratings — Specified ripple current of 19 mA at 120 Hz and 28.5 mA at 10 kHz for application planning.
• Soldering Robustness — Meets resistance-to-soldering-heat conditions as defined in the series specification (hot plate 250 °C for 30 s).

Typical Applications

• Automotive electronic modules — Designed for use in automotive systems where AEC-Q200 components are required and a compact SMD capacitor is needed.
• High-density PCB assemblies — Chip-type SMD package tailored for compact board layouts and automated placement on carrier-tape fed lines.
• Industrial and embedded electronics — Suitable where wide ambient temperature range (-55 °C to +105 °C) and defined high-temperature life performance are needed.

Unique Advantages

• AEC-Q200 compliance — Provides qualification aligned with automotive-grade component requirements for designs that mandate AEC-Q200 parts.
• Wide operating temperature — -55 °C to +105 °C rating supports use across broad thermal environments without losing rated performance.
• Long high-temperature load life — 2000 hours at +105 °C load life offers predictable endurance for elevated-temperature applications.
• Compact SMD can package — Small footprint (5.8 × 5.0 mm) allows space-efficient placement on high-density boards.
• Automated assembly friendly — Compatible with carrier-tape feeding for pick-and-place processes, helping maintain production efficiency.
• Regulatory compliance — RoHS conformity for use in regulated product lines and markets.

Why Choose UUT1H4R7MCL1GS?

The UUT1H4R7MCL1GS combines a compact chip-type aluminum electrolytic form factor with specifications aimed at high-temperature, high-density SMD applications. With AEC-Q200 and RoHS compliance, defined ripple current ratings, and a 2000-hour load-life at +105 °C, it is positioned for engineers specifying reliable, compact electrolytic capacitors for demanding assemblies.

This part is well suited to customers designing or maintaining systems that require AEC-Q200-qualified components and validated high-temperature performance, particularly where automated, carrier-tape placement is used. Please note availability status when planning long-term production given the product’s discontinuation schedule.

If you would like pricing, availability, or a formal quote for UUT1H4R7MCL1GS, submit a request or inquiry and our team will follow up with the necessary details.