UWF1C100MCL1GB

The UWF1C100MCL1GB is a chip‑type aluminum electrolytic capacitor from Nichicon’s UWF series, engineered for surface mounting on high‑density printed circuit boards. It provides low impedance performance up to +105°C and is suitable for automotive electronic applications where AEC‑Q200 qualification is required.

Designed for automated assembly, this SMD radial can supports carrier‑tape feeding and offers a compact footprint for power decoupling and smoothing on space‑constrained boards.

Key Features

• Capacitance & Voltage — 10 µF nominal capacitance with a 16 V rated voltage and ±20% tolerance for standard power decoupling use.
• Temperature Range & Endurance — Rated for operation from −55°C to +105°C with an endurance specification of 1000 hours at 105°C.
• Low Impedance Design — Chip‑type low impedance construction with an indicated impedance value (5 Ω) for improved ripple handling in compact designs.
• Ripple Current Capability — Rated ripple current: 25 mA at 120 Hz and 50 mA at 10 kHz to support AC components on the supply rail.
• AEC‑Q200 Rated — Listed with AEC‑Q200 compliance for applications requiring automotive qualification.
• SMD Chip Package — Radial, can‑style SMD package sized L: 5.4 × D: 4 mm with recommended PCB land 4.3 × 4.3 mm; compatible with carrier tape for automatic mounting machines.
• Leakage & Dissipation — Leakage current specified as not more than 0.01CV or 3 µA (whichever is greater); tan δ (loss tangent) maximum 0.16 at the 16 V rating (measured at 120 Hz, 20°C).

Typical Applications

• Automotive Electronics — AEC‑Q200 compliant option for board‑level bulk decoupling and smoothing in automotive electronic modules.
• High‑Density PCBs — Chip‑type SMD package designed for use on compact, densely populated printed circuit boards where board space is limited.
• Automated Assembly — Compatible with carrier‑tape feeding and automatic mounting machines for high‑volume surface‑mount production.

Unique Advantages

• High‑Temperature Endurance: Rated to +105°C with a 1000‑hour endurance at that temperature, supporting designs exposed to elevated operating conditions.
• Automotive‑Grade Qualification: AEC‑Q200 listing provides traceable qualification for automotive and similarly demanding environments.
• Compact SMD Form Factor: Small L: 5.4 × D: 4 mm package and 4.3 × 4.3 mm recommended land pattern enable compact layout and efficient use of board area.
• Assembly‑Friendly: Carrier‑tape compatibility streamlines pick‑and‑place assembly for automated production lines.
• Measured Ripple Handling: Specified ripple currents at 120 Hz and 10 kHz support a range of switching and low‑frequency power conditions.
• Defined Electrical Limits: Clear leakage and tan δ specifications help engineers size margins and predict behavior in end applications.

Why Choose UWF1C100MCL1GB?

UWF1C100MCL1GB combines a compact chip‑type SMD package with automotive‑grade qualifications and high‑temperature endurance to meet the needs of space‑constrained, reliability‑focused designs. Its low impedance characteristics, defined ripple current ratings, and clear electrical limits make it straightforward to integrate into power rails and decoupling networks on dense PCBs.

This part is suited for engineers and procurement teams specifying components for applications that demand AEC‑Q200 compliance, automated assembly compatibility, and predictable performance across a −55°C to +105°C operating range.

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