UWF1C220MCL1GB

CAP ALUM 22UF ±20% 16V SMD
Part Description

22 µF 16 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 1,318 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUWF
ManufacturerNichicon
Manufacturing StatusEnd Of Life
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotiveCapacitance22 µFECCNEAR99
ESRN/AHeight Seated (Max)5.4 mmHTS Code8532.22.0020
Impedance2.6 OhmLead SpacingN/ALifetime @ Temp1000 h @ 105°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-55°C - 105°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency80 mA @ 10 kHzRipple Current Low Frequency40 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension5.4 x 5 mmSurface Mount Land Size5.3 x 5.3 mm
Tolerance-20%~20%Voltage16 V

Overview of UWF1C220MCL1GB – 22 µF, 16 V AEC-Q200 SMD Aluminum Electrolytic Capacitor

The UWF1C220MCL1GB is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface mounting on high-density PCBs. It provides 22 µF capacitance at a 16 V rating, optimized for applications requiring wide operating temperature range and AEC-Q200 reliability.

Built for automated assembly (carrier-tape compatible) and RoHS compliant, this part is intended for automotive and industrial applications that demand stable capacitance and temperature resilience. Note: this product is scheduled for discontinuation and is not recommended for new designs.

Key Features

  • Capacitance & Voltage — 22 µF rated capacitance at 16 V, with ±20% tolerance at 120 Hz, 20 °C.
  • Temperature Range — Rated for operation from −55 °C to +105 °C, with endurance specified as 1,000 hours at 105 °C.
  • Low Impedance Performance — Chip-type, low-impedance construction; specified impedance entry lists 2.6 Ω and maximum tan δ of 0.16 at 16 V (measured at 120 Hz, 20 °C).
  • Ripple Handling — Ripple current ratings: 40 mA at 120 Hz (low frequency) and 80 mA at 10 kHz (high frequency), suitable for decoupling and smoothing in high-density designs.
  • Surface-Mount Chip Package — Compact SMD can: L 5.4 × D 5.0 mm with recommended land size L 5.3 × W 5.3 mm; compatible with automatic mounting machines fed by carrier tape.
  • Reliability & Standards — AEC-Q200 compliant and RoHS (2011/65/EU, (EU)2015/863) compliant; leakage current specification after 2 minutes at 20 °C: ≤ 0.01CV or 3 µA, whichever is greater.

Typical Applications

  • Automotive Electronics — Suitable for in-vehicle power decoupling and filtering where AEC-Q200 reliability and −55 °C to +105 °C operation are required.
  • Power Supply Decoupling — Compact SMD chip package delivers bulk capacitance and ripple handling for local supply smoothing on dense PCBs.
  • Industrial Control Modules — Temperature endurance and low-impedance characteristics support stable operation in industrial environments and control electronics.

Unique Advantages

  • AEC-Q200 Compliance — Provides a documented reliability baseline for automotive and demanding applications where industry qualification is required.
  • Wide Temperature Endurance — Rated to −55 °C to +105 °C with 1,000 h endurance at 105 °C, supporting prolonged high-temperature operation.
  • Compact, Assembly-Friendly Package — Chip-type SMD can with carrier-tape compatibility simplifies placement on high-density PCBs and supports automated assembly workflows.
  • Measured Low-Loss Performance — Specified tan δ and low leakage current support predictable filtering and decoupling performance across temperature.
  • RoHS Compliant — Meets current RoHS directive requirements for use in regulated supply chains.

Why Choose UWF1C220MCL1GB?

UWF1C220MCL1GB combines compact chip-type packaging with AEC-Q200-rated reliability and a wide −55 °C to +105 °C operating range, making it a practical choice for automotive and industrial replacement or legacy designs that require stable capacitance and controlled impedance. The part's automated-assembly compatibility and clear leakage/tan δ specifications help streamline BOM planning and system validation.

Please note the product is scheduled for discontinuation and is not recommended for new designs; it is most appropriate for supporting existing designs, repairs, or aftermarket production where matching legacy components is necessary.

Request a quote or contact our sales team to confirm current availability, lead times and to discuss support for legacy or maintenance projects.

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