UWF1C330MCL1GB

The UWF1C330MCL1GB is a chip-type aluminum electrolytic capacitor optimized for surface-mount applications on high-density PC boards. It delivers 33 µF capacitance at 16 V in a compact SMD can package designed for automated carrier-tape mounting.

Engineered for demanding temperature environments, this device offers low impedance and a wide operating range from −55 °C to +105 °C, making it suitable for electronic power decoupling and smoothing in rugged systems where temperature stability and board-level integration matter.

Key Features

• Capacitance & Voltage — 33 µF rated capacitance at 16 V for bulk decoupling and smoothing tasks.
• Low Impedance — Specified impedance of 1.3 Ω supports improved ripple handling and stable performance in power circuits.
• Temperature Range & Endurance — Operates from −55 °C to +105 °C with a rated life of 1000 hours at 105 °C.
• Ripple Current Capability — Rated ripple current of 57.5 mA at 120 Hz and 115 mA at 10 kHz for AC stress handling in power rails.
• Surface-Mount Can Package — Radial can SMD footprint sized L: 5.4 × D: 6.3 mm with recommended land 6.6 × 6.6 mm for compact board layouts.
• Reliability Characteristics — Leakage current specification (≤ 0.01CV or 3 µA after 2 minutes at 20 °C), tan δ and impedance limits, plus resistance-to-soldering-heat validation (30 s at 250 °C).
• Automotive-Grade Qualification — AEC-Q200 compliant to address reliability requirements in transportation electronics.
• RoHS Compliant — Conforms to RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronic Modules — Power filtering and bulk decoupling on control modules and body electronics where AEC-Q200 qualification and wide temperature range are required.
• Power Supply Filtering — Smoothing and ripple reduction on compact SMD power rails in high-density boards.
• Telematics and Infotainment — Local energy storage and transient suppression in vehicle communication and infotainment power networks.

Unique Advantages

• Compact SMD Form Factor: Small L: 5.4 × D: 6.3 mm package with a 6.6 × 6.6 mm land recommendation enables high-density board designs and automated assembly.
• Wide Temperature Operation: −55 °C to +105 °C rating and 1000 h endurance at 105 °C provide predictable performance in thermally challenging environments.
• Measurable Low Impedance: 1.3 Ω impedance specified for this part supports effective ripple handling and stable decoupling behavior.
• Automotive-Grade Reliability: AEC-Q200 compliance supports use in transportation electronics requiring standardized reliability testing.
• Defined Electrical Limits: Clear leakage current, tan δ, and low-temperature impedance ratios from the datasheet enable straightforward modeling during design.

Why Choose UWF1C330MCL1GB?

The UWF1C330MCL1GB combines a compact chip-type SMD can package with defined low-impedance performance and temperature endurance up to +105 °C. Its AEC-Q200 qualification and RoHS compliance make it appropriate for engineers specifying reliable power-filtering capacitors for automotive and other environmentally demanding applications.

This part is suited to designers who need a small-footprint aluminum electrolytic capacitor with quantified ripple current, leakage, and endurance characteristics—helping simplify BOM decisions and ensure predictable board-level performance under thermal stress.

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