UWF1E150MCL1GB

The UWF1E150MCL1GB is a chip-type aluminum electrolytic capacitor from Nichicon's UWF series designed for surface mounting on high-density PC boards. It offers low impedance performance in a compact surface-mount can package suitable for automated placement with carrier tape.

Targeted at demanding electronic assemblies, this part supports an operating temperature range from -55 °C to +105 °C and carries AEC-Q200 and RoHS compliance for regulated applications.

Key Features

• Capacitance & Voltage — 15 µF nominal capacitance rated at 25 V, with a tolerance of ±20%.
• Low Impedance Chip Type — Designed as a low impedance chip-style electrolytic for improved filtering and decoupling performance; specified impedance is 1.3 Ω.
• Temperature & Endurance — Rated for operation from -55 °C to +105 °C with an endurance rating of 1000 hours at 105 °C.
• Ripple Current Capability — Specified ripple currents of 57.5 mA at 120 Hz and 115 mA at 10 kHz to support AC ripple handling in power circuits.
• Surface-Mount, Tape-Ready — Chip can package (radial, can - SMD) designed for surface-mounting and compatible with automatic placement from carrier tape.
• Automotive-Grade Reliability — AEC-Q200 compliant to address reliability requirements in automotive electronic assemblies.
• Environmental Compliance — RoHS compliant (2011/65/EU, (EU)2015/863).
• Compact Footprint — Physical size L: 5.4 × D: 6.3 mm with recommended land pattern L: 6.6 × W: 6.6 mm for high-density PCB layouts.

Typical Applications

• Automotive Electronics — Use in ECU modules, sensors, and control units where AEC-Q200 qualification and elevated temperature capability are required.
• Power Supply Filtering — Local bulk and ripple filtering on high-density surface-mount power rails operating up to 25 V.
• High-density PCB Assemblies — Suitable for compact board designs requiring automated placement and small SMD capacitor solutions.

Unique Advantages

• Low-impedance performance: Specified 1.3 Ω impedance supports effective decoupling and ripple suppression in compact layouts.
• High-temperature endurance: Rated to +105 °C with a 1000-hour endurance rating at that temperature for stable long-term operation in hot environments.
• Automated assembly friendly: Tape-feed compatibility and SMD can package simplify high-volume placement and reduce manufacturing complexity.
• Automotive-capable: AEC-Q200 compliance provides an added reliability credential for vehicle electronics and other demanding applications.
• Compact board footprint: Small case dimensions and defined land pattern allow dense placement on space-constrained PCBs.
• Regulatory compliance: RoHS conformance supports environmental requirements in regulated markets.

Why Choose UWF1E150MCL1GB?

UWF1E150MCL1GB from Nichicon's UWF series combines a chip-style aluminum electrolytic topology with low impedance characteristics and elevated temperature endurance to meet the needs of compact, high-density electronic assemblies. Its 15 µF / 25 V rating, defined ripple current values, and AEC-Q200 compliance make it suitable for applications demanding reliable filtering and decoupling under thermal stress.

This part is appropriate for engineers specifying SMD electrolytic capacitors for automotive electronics, power modules, and tightly packed PCBs where automated placement and a small footprint are priorities. The defined mechanical and electrical specifications facilitate predictable integration into production assemblies.

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