UWF1E100MCL1GB

The UWF1E100MCL1GB is a surface‑mount, chip‑type aluminum electrolytic capacitor designed for low‑impedance decoupling and smoothing on high‑density PCBs. It delivers 10 µF capacitance at a 25 V rating with targeted electrical characteristics for thermal and frequency stability.

Engineered for applications that require compact size and elevated temperature capability, the device offers a -55 °C to +105 °C operating range and a 1000‑hour endurance at 105 °C. Note: this product is discontinued and not recommended for new designs.

Key Features

• Capacitance & Voltage — 10 µF capacitance rated at 25 V, ±20% tolerance for general power‑rail decoupling and filtering.
• Low Impedance — Specified impedance of 2.6 Ω with a tan δ of 0.14 (20 °C, 120 Hz) to support stable performance in AC and ripple environments.
• Ripple Current Performance — Rated ripple currents of 40 mA at 120 Hz and 80 mA at 10 kHz; frequency coefficient reaches 0.50 at 120 Hz and 1.00 at 10 kHz or more.
• Reliability & Lifetime — 1000 hours rated life at 105 °C with endurance criteria of capacitance within ±20%, tan δ ≤ 200% of initial, and leakage current within initial limits after test.
• Leakage & Loss — Low leakage current specified at 3 µA (or 0.01CV, whichever is greater) and controlled loss angle for predictable ESR behavior.
• Package & Assembly — Chip‑type radial can in SMD format (L: 5.4 × D: 5 mm) supplied in embossed carrier tape for automated placement; recommended land size 5.3 × 5.3 mm.
• Environmental & Screening — RoHS compliant and AEC‑Q200 rated for automotive screening and related demanding environments.

Typical Applications

• Automotive Electronics — Suitable for ECU modules and control electronics where AEC‑Q200 screening and 105 °C endurance support reliability under elevated temperatures.
• Power Supply Decoupling — Compact chip package and low impedance make it appropriate for local decoupling and smoothing on DC‑DC converters and power rails.
• Sensor and Interface Modules — Low leakage and stable tan δ support use in sensor front‑end and signal‑conditioning circuits requiring predictable biasing and filtering.
• High‑Density PCB Designs — Small footprint and embossed tape packaging enable automated placement in space‑constrained assemblies.

Unique Advantages

• Compact, board‑friendly footprint: 5.4 × 5 mm chip can fits high‑density PCBs while providing useful capacitance for local energy storage.
• Proven high‑temperature endurance: 1000 hours at 105 °C offers predictable aging and stability in thermal stress conditions.
• Low leakage and controlled loss: 3 µA leakage specification and tan δ of 0.14 (25 V, 120 Hz) deliver reliable bias and dissipation characteristics.
• Frequency‑aware ripple capability: Rated ripple currents at 120 Hz and 10 kHz with published frequency coefficients enable designers to size components for specific switching and line frequencies.
• Assembly compatible: Embossed carrier taping and recommended land pattern simplify automated pick‑and‑place and reflow assembly processes.
• Automotive screening: AEC‑Q200 compliance supports use in automotive‑grade applications and similar demanding environments.

Why Choose UWF1E100MCL1GB?

The UWF1E100MCL1GB balances compact dimensions with reliable electrical performance for designs that require low‑impedance decoupling at elevated temperatures. Its combination of a 25 V rating, controlled tan δ, low leakage, and AEC‑Q200 screening makes it a practical choice for service in automotive and other demanding embedded systems.

Use this part where small footprint, predictable ripple handling, and high‑temperature endurance are key selection criteria. The embossed tape format and defined land pattern help streamline high‑volume assembly and reduce placement complexity.

Request a quote or submit a product inquiry for UWF1E100MCL1GB by providing your required quantities and delivery schedule to our sales team.