UWF1C470MCL1GB

The UWF1C470MCL1GB is a chip-type aluminum electrolytic capacitor engineered for surface-mount, high-density PCB designs. It delivers a 47 µF capacitance at 16 V in a compact φ6.3 × 5.4 mm SMD can, optimized for low-impedance power filtering and decoupling.

Designed with a wide operating temperature range and automotive-grade reliability, this part is AEC-Q200 rated and RoHS compliant, offering specified ripple performance and endurance for demanding environments.

Key Features

• Capacitance & Voltage: 47 µF nominal capacitance with a 16 V rated voltage and ±20% tolerance, suitable for bulk decoupling and local energy storage.
• Chip-Type, Low Impedance: Chip-format aluminum electrolytic construction with low impedance (1.3 Ω) to support stable filtering performance.
• Ripple Performance: Specified ripple currents of 57.5 mA at 120 Hz and 115 mA at 10 kHz for reliable AC handling across low- and high-frequency domains.
• Leakage Current: Low leakage current specified at 7.52 µA, helping minimize steady-state loss in power rails.
• Temperature & Endurance: Wide operating range from -55 °C to 105 °C with an endurance rating of 1000 hours at 105 °C to support long-term stability under elevated temperature stress.
• Package & Assembly: φ6.3 × 5.4 mm radial can in SMD format with embossed carrier taping for automated pick-and-place and high-density mounting; recommended land size 6.6 × 6.6 mm.
• Compliance & Quality: AEC-Q200 rated and RoHS compliant, aligning with automotive-grade component requirements.

Typical Applications

• Automotive electronics: Suitable for use in automotive electronic modules where AEC-Q200-rated components are required for power filtering and decoupling.
• High-density surface-mount PCBs: Chip-type SMD package and compact form factor enable placement on space-constrained boards for power rail stabilization.
• Automated assembly lines: Embossed carrier taping makes this part compatible with automated mounting equipment for streamlined production.

Unique Advantages

• Compact SMD footprint: φ6.3 × 5.4 mm package minimizes board area while providing 47 µF capacitance for local energy storage.
• Low-impedance performance: 1.3 Ω impedance combined with specified ripple currents supports effective filtering across low and high frequencies.
• Automotive-grade reliability: AEC-Q200 rating and 1000 h endurance at 105 °C deliver demonstrated stability for applications exposed to elevated temperatures.
• Manufacturing-ready packaging: Embossed carrier taping and surface-mount design simplify automated placement and high-volume assembly.
• Regulatory compliance: RoHS-compliant construction helps meet environmental requirements in regulated markets.

Why Choose UWF1C470MCL1GB?

UWF1C470MCL1GB combines a compact chip-style aluminum electrolytic package with low-impedance characteristics, defined ripple handling, and automotive-grade ratings to support robust power supply decoupling on space-constrained PCBs. Its wide temperature range and 1000-hour endurance at 105 °C provide predictable performance in thermally demanding applications.

This part is well suited to engineers and procurement teams specifying AEC-Q200-rated SMD capacitors for automotive modules, industrial control electronics, and other systems that require reliable filtering, automated assembly compatibility, and RoHS compliance.

Request a quote or contact sales to discuss availability, pricing, and delivery for UWF1C470MCL1GB.