UWF1E220MCL1GB

The UWF1E220MCL1GB is a chip-type aluminum electrolytic capacitor from Nichicon’s UWF series designed for surface-mount applications. It delivers 22 µF at 25 V in a compact radial can SMD package with low impedance characteristics and a wide operating temperature range.

Targeted for demanding electronic assemblies, this component is suitable for applications requiring compact decoupling and filtering at temperatures up to +105°C. Note: this product is scheduled for discontinuation and is not recommended for new designs.

Key Features

• Capacitance & Voltage — 22 µF rated capacitance with a 25 V rating and ±20% tolerance, suitable for local decoupling and bulk filtering in compact designs.
• Low Impedance Performance — Specified impedance of 1.3 Ω and low-impedance chip-type construction to improve ripple handling and transient response.
• High Temperature Endurance — Operates from −55°C to +105°C with an endurance specification of 1000 hours at 105°C.
• Ripple Current Ratings — Rated ripple current of 57.5 mA at 120 Hz and 115 mA at 10 kHz, aiding in AC ripple suppression across common operating frequencies.
• Surface-Mount Package — Radial, can-type SMD package sized L: 5.4 × D: 6.3 mm with a recommended PCB land size of 6.6 × 6.6 mm for automated placement.
• Assembly Friendly — Designed for automatic mounting machines and carrier-tape feed to support high-density PC board assembly.
• Compliance — RoHS compliant and AEC-Q200 compliant, providing traceable conformity for regulated and reliability-focused designs.

Typical Applications

• Automotive Electronics — Used for power rail decoupling and filtering in modules that require components rated to automotive reliability standards.
• Power Supply Filtering — Compact SMD form factor and low impedance make it suitable for localized smoothing and ripple suppression on DC power lines.
• Embedded Control Boards — Fits high-density PCBs where small footprint and automated assembly compatibility are required.

Unique Advantages

• Compact SMD Can Package — Small L: 5.4 × D: 6.3 mm footprint minimizes board area while providing aluminum electrolytic capacitance.
• Automated Assembly Ready — Carrier-tape compatible and designed for automatic mounting machines to streamline volume production.
• High-Temperature Reliability — Rated for operation up to +105°C with a 1000-hour endurance rating at that temperature for stability in elevated-temperature environments.
• Frequency-Oriented Ripple Capability — Published ripple current figures at both low and high frequencies (120 Hz and 10 kHz) support designers working across common power-frequency ranges.
• Standards Compliance — RoHS and AEC-Q200 compliance provide documented conformity for regulated markets and reliability-focused applications.

Why Choose UWF1E220MCL1GB?

The UWF1E220MCL1GB pairs a compact chip-type SMD can with proven aluminum electrolytic performance: 22 µF at 25 V, low impedance, and rated endurance at elevated temperatures. Its small footprint and tape-and-reel assembly compatibility make it a practical choice for dense boards where automated placement and reliable ripple handling are required.

Produced by Nichicon and specified to AEC-Q200 and RoHS, this part is suitable for designs that need documented high-temperature endurance and standardized compliance. It is best suited for existing designs and repair/maintenance inventories given its discontinued status.

If you require pricing, availability, or a formal quote for UWF1E220MCL1GB, please request a quote or contact our sales team to discuss lead times and ordering options.