UWF1V2R2MCL1GB
| Part Description |
2.2 µF 35 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,906 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UWF |
| Manufacturer | Nichicon |
| Manufacturing Status | End Of Life |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 2.2 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 5.4 mm | HTS Code | 8532.22.0020 | ||
| Impedance | 5 Ohm | Lead Spacing | N/A | Lifetime @ Temp | 1000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 50 mA @ 10 kHz | Ripple Current Low Frequency | 25 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.4 x 4 mm | Surface Mount Land Size | 4.3 x 4.3 mm | ||
| Tolerance | -20%~20% | Voltage | 35 V |
Overview of UWF1V2R2MCL1GB – Surface-mount low-impedance aluminum electrolytic capacitor, 35 V / 2.2 µF
The UWF1V2R2MCL1GB is a surface-mount, chip-type aluminum electrolytic capacitor engineered for low-impedance applications. With a rated voltage of 35 V and a nominal capacitance of 2.2 µF (±20%), it targets compact, high-density PCB assemblies requiring stable performance up to 105°C.
Designed for automatic mounting (embossed carrier taping) and AEC‑Q200 certification, this part suits electronics that demand temperature-rated reliability and RoHS compliance.
Key Features
- Core Electrical — 2.2 µF nominal capacitance with ±20% tolerance at 120 Hz, 20°C; rated voltage 35 V.
- Low Loss / Low Impedance — tan δ ≤ 0.12 (measured at 120 Hz, 20°C) and specified impedance of 5 Ω to support low-impedance circuit requirements.
- Thermal and Endurance — Operating temperature range −55°C to +105°C and rated endurance of 1000 hours at 105°C.
- Ripple and Leakage — Rated ripple current 25 mA at 120 Hz and 50 mA at 10 kHz; leakage current ≤ 3 µA after 2 minutes at rated voltage and 20°C.
- Package & Mounting — φ4 × 5.4 L radial can SMD (size L: 5.4 × D: 4 mm) with embossed carrier taping; recommended land size L: 4.3 × W: 4.3 mm for surface-mount assembly.
- Industry Qualifications — AEC‑Q200 rated and RoHS compliant; marked for 105°C operation.
Typical Applications
- Automotive Electronics — Suitable for automotive electronic modules that require AEC‑Q200 qualification and operation up to 105°C.
- Surface-mount Assemblies — Designed for automated placement on high-density PCBs using embossed carrier taping.
- High-temperature Electronics — Intended for applications where components must maintain performance and endurance at temperatures up to 105°C.
Unique Advantages
- Compact SMD can — φ4 × 5.4 mm package enables space-efficient placement on tightly packed circuit boards.
- Low-loss performance — Low tan δ and specified impedance provide stable behavior in AC and filtering applications at the stated measurement conditions.
- Temperature-rated reliability — −55°C to +105°C operating range and 1000-hour endurance at 105°C support sustained operation in elevated-temperature environments.
- Automotive-grade qualification — AEC‑Q200 certification confirms suitability for automotive-grade development flows and reliability expectations.
- Assembly-ready packaging — Embossed carrier taping supports automated pick-and-place processes for high-volume manufacturing.
- Low leakage — Leakage current specified at ≤ 3 µA after 2 minutes at rated voltage helps minimize standby losses.
Why Choose UWF1V2R2MCL1GB?
The UWF1V2R2MCL1GB combines a compact surface-mount can with low-loss electrical characteristics and automotive-grade qualification, making it a strong choice for engineers designing temperature-challenged or space-constrained boards. Its 35 V rating and 2.2 µF capacitance deliver a balanced option for power and signal applications where low impedance and reliable high-temperature performance are required.
This part is particularly well suited to teams building AEC‑Q200‑level products and those who require a component packaged for automated assembly and long-term operation at up to 105°C.
If you would like pricing, availability, or to submit a quote request for UWF1V2R2MCL1GB, please request a quote or contact sales through your preferred procurement channel to receive further details and lead‑time information.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016