UWF1V470MCL1GS

The UWF1V470MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface mounting on high-density PC boards. It combines a 47 µF capacitance with a 35 V rating and compact SMD packaging to support localized power decoupling and filtering.

Engineered for robust thermal performance, the device operates from −55°C to +105°C and meets AEC-Q200 and RoHS requirements. Its assembly-friendly package is compatible with automatic mounting machines fed with carrier tape, making it suitable for production lines targeting compact and reliable electronic modules.

Key Features

• Capacitance & Voltage: 47 µF nominal capacitance at a 35 V rated voltage, with ±20% tolerance for standard decoupling and bulk storage applications.
• Low Impedance: Specified impedance of 800 mΩ to reduce AC ripple and improve transient response in power circuits.
• Wide Temperature Range: Operates from −55°C to +105°C, supporting designs exposed to broad environmental conditions.
• Automotive-Grade Reliability: AEC-Q200 compliant, meeting qualification criteria required for many automotive electronics applications.
• Endurance & Lifetime: Rated for 1000 hours at 105°C, with endurance characteristics specified for capacitance, tan δ, and leakage current following the endurance test.
• Ripple Current Capability: 75 mA at 120 Hz and 150 mA at 10 kHz (high frequency), suitable for typical switching regulator and decoupling environments.
• SMD Chip Package: Radial can SMD package with case dimensions L: 6.2 × D: 8 mm and recommended PCB land size of 8.3 × 8.3 mm; designed for automated carrier-tape mounting and reflow-compatible assembly.
• Regulatory Compliance: RoHS compliant to EU directives, supporting environmentally conscious designs.

Typical Applications

• Automotive electronic modules: Power filtering and decoupling in automotive ECUs and control modules where AEC-Q200 qualification is required.
• High-density PCB power stages: Local bulk and ripple suppression on compact surface-mount boards used in embedded systems.
• Automated SMD production: Designed for use with carrier-tape fed automatic mounting machines to streamline high-volume assembly.

Unique Advantages

• Compact chip-style SMD footprint: Small L: 6.2 × D: 8 mm package reduces board area while providing useful capacitance for local power needs.
• Temperature resilience: −55°C to +105°C rating and 1000-hour endurance at 105°C for reliable operation in thermally demanding environments.
• Automotive qualification: AEC-Q200 compliance provides confidence for use in automotive-grade designs.
• Assembly-ready: Carrier-tape compatibility and SMD form factor simplify automated placement and throughput.
• Low-impedance performance: 800 mΩ impedance and specified ripple current ratings help reduce voltage ripple and improve regulator stability.
• Environmental compliance: RoHS conformity supports regulatory requirements for restricted substances.

Why Choose UWF1V470MCL1GS?

The UWF1V470MCL1GS balances compact SMD packaging with low-impedance performance and automotive-grade qualification, making it well suited for engineers designing power stages on space-constrained, high-density PCBs. Its combination of temperature range, endurance at elevated temperature, and ripple current capability provides a verifiable specification set for reliable decoupling and filtering.

This part is a fit for teams developing automotive modules, embedded power supplies, and other applications requiring AEC-Q200 compliance and automated assembly compatibility, offering predictable electrical and thermal behavior backed by Nichicon's component specifications.

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