UWG0J102MNL1GS

The UWG0J102MNL1GS is a chip‑type aluminum electrolytic capacitor from Nichicon designed for surface‑mount use on high‑density PC boards. It provides 1 mF capacitance at a rated voltage of 6.3 V in a compact SMD can package sized 1 cm × 1 cm.

Engineered for robust operation across a wide temperature range (−55 °C to +105 °C) and qualified to AEC‑Q200, this part is intended for demanding applications that require low impedance, defined ripple current capability, and compatibility with automated assembly processes.

Key Features

• Capacitance & Voltage 1 mF capacitance at 6.3 V rated voltage for bulk energy storage in a compact SMD form factor.
• Low Impedance Low impedance construction with a specified impedance of 150 mΩ to support low‑loss performance in power circuits.
• Wide Temperature Range & Endurance Rated for −55 °C to +105 °C operation with an endurance specification of 1000 hours at 105 °C.
• AEC‑Q200 Qualified AEC‑Q200 qualification indicates suitability for automotive electronics applications where that qualification is required.
• Surface‑Mount, Automatic Assembly Ready Chip‑type SMD can package (L: 1 cm × D: 1 cm) designed for surface mounting and compatible with carrier‑tape automatic mounting machines.
• Ripple Current Ratings Defined ripple current capability: 335 mA at 120 Hz and 670 mA at 10 kHz, supporting dynamic load conditions.
• Polarized with Standard Tolerance Polarized capacitor with capacitance tolerance of −20% to +20% (120 Hz, 20 °C).
• RoHS Compliant Conforms to RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive electronics — AEC‑Q200 qualified and rated for −55 °C to +105 °C, suitable for electronic modules used in automotive systems.
• High‑density PCB assemblies — Chip‑type SMD can and carrier‑tape compatibility make this capacitor well suited to densely populated boards requiring automated placement.
• Power management circuits — 1 mF capacitance with low impedance and specified ripple current supports bulk decoupling and smoothing in compact power modules.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q200 qualification provides confidence for use in applications where that standard is required.
• Wide operating temperature: −55 °C to +105 °C rating extends usable range across harsh environments.
• Compact SMD package: 1 cm × 1 cm chip‑type can offers high capacitance in a small footprint compatible with automated assembly.
• Low impedance performance: 150 mΩ impedance supports lower voltage ripple and improved dynamic response.
• Defined ripple handling: Ripple current ratings at 120 Hz and 10 kHz provide quantifiable limits for thermal and reliability planning.
• Long endurance at elevated temperature: Specified 1000 hours at 105 °C for reliability planning in high‑temperature applications.

Why Choose UWG0J102MNL1GS?

UWG0J102MNL1GS combines a high value of capacitance (1 mF) in a chip‑type SMD can with low impedance and defined ripple current capability, backed by AEC‑Q200 qualification and RoHS compliance. Its compact footprint and carrier‑tape compatibility make it a practical choice for automated assembly on high‑density PCBs where temperature resilience and reliability are required.

This part is a strong option for design teams specifying components for automotive electronic modules, compact power supplies, and other applications that need robust, predictable capacitor performance across a wide temperature range and through endurance conditions.

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