UWG0J221MCL1GS

The UWG0J221MCL1GS is a chip‑type aluminum electrolytic capacitor designed for surface mounting on high‑density PC boards. As a low‑impedance, polarized SMD can, it targets compact power filtering and decoupling duties where stable capacitance and reliable operation across a broad temperature range are required.

Key value comes from its wide operating temperature range (−55 °C to +105 °C), AEC‑Q200 qualification, RoHS compliance, and construction compatible with automatic carrier‑tape mounting for automated assembly.

Key Features

• Electrical Performance — 220 µF capacitance at a rated voltage of 6.3 V with an impedance of 400 mΩ; capacitance tolerance is ±20% (−20% to +20%).
• Low Loss / Ripple Capability — Ripple current ratings of 115 mA at 120 Hz and 230 mA at 10 kHz support AC ripple handling for smoothing and decoupling applications.
• Wide Temperature Range — Specified to operate from −55 °C to +105 °C, enabling use across demanding thermal environments.
• Endurance and Reliability — Rated for 1000 hours at 105 °C with defined endurance limits for capacitance change, tan δ, and leakage current.
• Package & Mounting — Chip‑type SMD radial can (L: 6.2 × D: 8 mm) designed for surface mounting on high‑density PCBs; compatible with automatic mounting machines fed with carrier tape. Recommended PCB land size: 8.3 × 8.3 mm.
• Compliance & Qualification — AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863), providing traceable conformity for regulated designs.
• Polarized Design — Polarized electrolytic construction for use where a polarized capacitor is required.

Typical Applications

• Automotive Electronics — Suited for automotive electronic modules that require components with AEC‑Q200 qualification and extended temperature operation.
• High‑Density Surface‑Mount PCBs — Designed for compact, densely populated boards where chip‑type SMD capacitors are needed for local decoupling and bulk capacitance.
• Automated Assembly Environments — Compatible with carrier‑tape feed for placement by automatic mounting machines, supporting high‑volume production workflows.

Unique Advantages

• Wide thermal operating window: −55 °C to +105 °C operation reduces the need for design workarounds in thermally challenging products.
• AEC‑Q200 qualified: Provides an industry‑recognized reliability baseline for automotive and other demanding applications.
• Low impedance and defined ripple ratings: 400 mΩ impedance with specified ripple current at 120 Hz and 10 kHz helps maintain voltage stability on power rails.
• SMD chip form factor for dense layouts: Compact L: 6.2 × D: 8 mm package and 8.3 × 8.3 mm recommended land pattern optimize board space usage.
• Manufacturing friendly: Designed for carrier‑tape feed and automatic placement to streamline assembly and reduce handling complexity.
• Lifecycle specification: 1000 hours at 105 °C endurance provides predictable long‑term behavior for lifetime planning.

Why Choose UWG0J221MCL1GS?

The UWG0J221MCL1GS combines low impedance, defined ripple capability, and a compact chip‑type SMD can to address capacitance needs on space‑constrained, thermally variable boards. Its AEC‑Q200 qualification and RoHS compliance make it a pragmatic choice for designs where regulated manufacturing and reliability credentials are required.

This part is suited for engineers specifying robust power decoupling and bulk capacitance on high‑density PCBs produced in automated assembly lines, offering predictable electrical and endurance characteristics for long‑term product planning.

Request a quote or submit an inquiry to receive pricing, availability, and technical support for UWG0J221MCL1GS. Our team can provide ordering information and assist with land‑pattern or application questions.