UWG0J152MNL1GS

The UWG0J152MNL1GS is a chip-type, low-impedance aluminum electrolytic capacitor from Nichicon, specified at 1500 µF and 6.3 V. It is designed for surface-mount assembly on high-density PC boards and is supplied in embossed carrier taping for automated placement.

Targeted for demanding environments, this part is AEC-Q200 qualified, RoHS compliant, and specified for operation from −55°C to 105°C with an endurance rating of 1000 hours at 105°C. Key electrical attributes include low impedance (150 mOhm), measurable loss tangent (tanδ 0.26 at 20°C, 120 Hz), and defined ripple and leakage performance.

Key Features

• Core / Architecture  Chip-type aluminum electrolytic capacitor optimized for surface-mount assembly on high-density PCBs and automatic mounting machines.
• Capacitance & Voltage  1.5 mF (1500 µF) nominal capacitance at a rated voltage of 6.3 V with ±20% tolerance.
• Low Impedance Performance  Rated impedance of 150 mOhm and tanδ (DF) of 0.26 measured at 20°C, 120 Hz for low-loss operation at the specified conditions.
• Ripple Current Handling  Low-frequency ripple current 335 mA at 120 Hz and high-frequency ripple current 670 mA at 10 kHz to support power-conditioning needs within the specified limits.
• Leakage Current  Specified leakage current of 94.5 µA under the stated measurement conditions.
• Temperature & Endurance  Operating temperature range −55°C to 105°C with endurance verified for 1000 hours at 105°C.
• Package & Assembly  Radial can SMD package (chip type) with embossed carrier taping for automated surface-mount placement; size noted as φ10x10L and SizeDimension L: 1 × D: 1 cm.
• Quality & Compliance  AEC-Q200 qualified and RoHS compliant for regulated supply chain requirements.

Typical Applications

• Automotive electronics  Designed for automotive use where AEC-Q200 qualification and wide temperature range support module-level power components.
• High-density surface-mount assemblies  Chip form factor and embossed carrier taping make this capacitor suitable for compact, automated PCB production.
• Power rail decoupling and smoothing  High capacitance (1500 µF) and defined ripple-current ratings support bulk decoupling and smoothing on power rails within the stated limits.

Unique Advantages

• High capacitance in an SMD chip package: 1500 µF nominal capacitance in a φ10x10L chip-type can reduces board area for bulk energy storage.
• Low impedance and controlled loss: 150 mOhm impedance and tanδ 0.26 (120 Hz, 20°C) enable improved transient response and lower losses at the specified conditions.
• Defined ripple performance: 335 mA (120 Hz) and 670 mA (10 kHz) ripple current ratings provide clear limits for power-conditioning design decisions.
• Automotive-grade qualification: AEC-Q200 qualification and a −55°C to 105°C operating range support use in regulated automotive electronic modules.
• Endurance-tested: Rated for 1000 hours at 105°C, offering a verifiable lifetime metric for high-temperature applications.
• Production-ready packaging: Embossed carrier taping and compatibility with automatic mounting machines streamline high-volume SMT assembly.

Why Choose UWG0J152MNL1GS?

The UWG0J152MNL1GS combines high capacitance and low impedance in a surface-mount chip form factor engineered for automated assembly and high-temperature endurance. Its specification set—including AEC-Q200 qualification, defined ripple current ratings, controlled loss tangent, and a wide −55°C to 105°C operating range—makes it suitable for designers specifying reliable bulk capacitance in compact, automotive-capable modules.

This Nichicon UWG-series part is a fit for teams needing a verifiable endurance rating (1000 hours at 105°C), RoHS compliance, and clear electrical limits to simplify selection and integration into power-conditioning, decoupling, and smoothing designs on dense PCBs.

If you would like pricing or availability for UWG0J152MNL1GS, request a quote or submit an inquiry to our sales team specifying the part number and required quantity.