UWF1V4R7MCL1GB

The UWF1V4R7MCL1GB is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface mounting on high-density PC boards. It delivers 4.7 µF at 35 V in a compact SMD can package and is built to operate across a wide temperature range from −55 °C to +105 °C.

Engineered for automated assembly, the part is compatible with carrier-tape feeding and meets RoHS and AEC-Q200 requirements, making it suitable for demanding automotive electronics environments that require temperature endurance and industry-grade qualification.

Key Features

• Electrical Performance — 4.7 µF rated capacitance at 35 V with a low impedance design; specified impedance of 5 Ω and capacitance tolerance of −20% to +20%.
• Temperature & Endurance — Rated for operation from −55 °C to +105 °C with an endurance rating of 1000 hours at 105 °C.
• Ripple Current Capability — Rated ripple current: 25 mA at 120 Hz and 50 mA at 10 kHz, supporting both low- and high-frequency ripple conditions.
• Packaging & Mounting — Chip-type radial can in an SMD configuration designed for high-density PCBs and automatic mounting with carrier tape; recommended surface-mount land size 4.3 × 4.3 mm.
• Quality & Compliance — AEC-Q200 compliant and RoHS directive (2011/65/EU,(EU)2015/863) compliant, aligning with industry environmental and reliability standards.
• Leakage and Stability — Leakage current specified per datasheet (after 2 minutes at rated voltage ≤ 0.01CV or 3 µA, whichever is greater); endurance and shelf-life characteristics maintained after specified thermal and voltage treatments.

Typical Applications

• Automotive Electronics — For electronic modules that require AEC-Q200-rated components and wide temperature operation up to +105 °C.
• High-Density Surface-Mount PCBs — Compact chip-type can for space-constrained boards where SMD capacitors are required.
• Automated Assembly Lines — Designed for carrier-tape fed pick-and-place processes to support high-volume manufacturing.

Unique Advantages

• Low-Impedance Performance: The chip-type construction and specified 5 Ω impedance support stable behavior under AC ripple conditions.
• Wide Operating Temperature: Rated from −55 °C to +105 °C, enabling use in temperature-demanding environments.
• Industry Qualification: AEC-Q200 compliance provides traceable qualification for automotive-grade applications.
• Assembly-Friendly Packaging: Carrier-tape compatibility and SMD can format simplify automated placement on high-density boards.
• Verified Endurance: Specified 1000-hour endurance at 105 °C with defined limits for capacitance change, dissipation factor, and leakage current.
• Regulatory Compliance: RoHS conformity supports environmentally compliant assemblies.

Why Choose UWF1V4R7MCL1GB?

UWF1V4R7MCL1GB combines a compact chip-type aluminum electrolytic form factor with low-impedance characteristics and AEC-Q200 qualification, making it a practical choice for automotive and other temperature-challenging, high-reliability surface-mount applications. Its carrier-tape compatibility and recommended land pattern support efficient automated assembly on high-density PCBs.

This part is suited to engineers and procurement teams specifying electrolytic SMD capacitors where temperature endurance, qualification, and assembly efficiency are priorities. The documented endurance, leakage, and soldering-heat characteristics give clear, testable parameters for design validation and reliability planning.

Request a quote or submit an inquiry for UWF1V4R7MCL1GB to check availability and obtain pricing and lead-time information from sales.