UWF1V6R8MCL1GB

The UWF1V6R8MCL1GB is a chip-type, low-impedance aluminum electrolytic capacitor in a compact surface-mount can. It delivers 6.8 µF capacitance at a 35 V rating with operating capability from −55 °C to 105 °C and is designed for high-density PCB assembly and automated placement (embossed carrier taping).

This part is AEC-Q200 compliant and RoHS compliant, targeted at applications that require a small, rugged SMD electrolytic capacitor with defined endurance (1000 hours at 105 °C). Note: this product is listed as End Of Life.

Key Features

• Capacitance & Voltage — 6.8 µF rated capacitance at 35 V.
• Low Impedance Chip Type — Chip-type, low impedance construction with specified impedance of 2.6 Ω.
• Loss Tangent (tan δ) — tanδ 0.12 measured at 20 °C, 120 Hz for stable AC performance.
• Leakage Current — Low leakage current specified at 3 µA.
• Ripple Current Performance — 40 mA at 120 Hz (low frequency) and 80 mA at 10 kHz (high frequency); frequency coefficient reaches 1.00 at 10 kHz or more.
• Temperature & Endurance — Operating temperature range −55 °C to +105 °C with endurance rated to 1000 hours at 105 °C.
• Package & Mounting — Chip-type radial can SMD, size φ5 × 5.4 mm (L: 5.4 × D: 5 mm) with recommended land size 5.3 × 5.3 mm and embossed carrier taping for automatic mounting.
• Qualification & Compliance — AEC-Q200 compliant and RoHS compliant.
• Polarized Design — Polarized aluminum electrolytic construction with black top marking.

Typical Applications

• Automotive electronics — AEC-Q200 compliance and 105 °C endurance make this capacitor suitable for automotive electronic modules requiring a compact SMD electrolytic solution.
• High-density PCB assemblies — Chip-type can and small footprint support placement on space-constrained boards and automated assembly using embossed carrier taping.
• Power filtering and decoupling on compact boards — Low impedance and defined ripple current specs support local smoothing in tight-layout power networks.

Unique Advantages

• Compact chip-type form factor: φ5 × 5.4 mm can provides high capacitance in a small surface-mount footprint for dense layouts.
• Low-impedance performance: Specified impedance of 2.6 Ω and a low tanδ (0.12) help reduce AC losses in filtering applications.
• Automated assembly ready: Embossed carrier taping and SMD configuration enable efficient placement on automated pick-and-place lines.
• High-temperature endurance: Rated for 1000 hours at 105 °C, supporting designs that operate at elevated temperatures.
• Industry qualification and compliance: AEC-Q200 compliance and RoHS status support regulated production environments and supply-chain requirements.
• Defined leakage and ripple limits: Low leakage (3 µA) and specified ripple currents (40 mA @120 Hz, 80 mA @10 kHz) simplify thermal and performance budgeting.

Why Choose UWF1V6R8MCL1GB?

The UWF1V6R8MCL1GB combines a compact chip-type SMD can with low impedance electrical characteristics and defined high-temperature endurance, making it a straightforward choice for engineers specifying electrolytic decoupling and smoothing capacitors for dense, thermally demanding boards. Its embossed carrier tape format and small land pattern ease integration into automated assembly flows.

With AEC-Q200 compliance and RoHS conformance, this part addresses regulated design environments where qualification and environmental compliance are required. Please note the part is listed as End Of Life; request a quote or availability inquiry for current stock and lead-time information.

Request a quote or submit an inquiry for availability, lead time and ordering information.