UWG0J331MNL1GS

The UWG0J331MNL1GS is a chip-type aluminum electrolytic capacitor from Nichicon’s UWG series, engineered for surface-mount use on high-density printed circuit boards. It delivers 330 µF at 6.3 V in a compact SMD radial-can package, combining low impedance and a wide operating temperature range for demanding environments.

Designed for automated assembly and compliant to RoHS, this part is AEC-Q200 qualified and intended for applications requiring robust thermal and mechanical performance across −55°C to +105°C.

Key Features

• Electrical Performance — Rated capacitance 330 µF at 6.3 V with ±20% tolerance and a low impedance of 300 mΩ for effective bulk energy storage in compact layouts.
• Temperature and Reliability — Rated for −55°C to +105°C operation with an endurance specification of 1000 hours at 105°C; endurance limits include capacitance change within ±20% and leakage current at or below initial specified values after test.
• Ripple Current Handling — Rated ripple current of 225 mA at 120 Hz and 450 mA at 10 kHz, supporting a range of frequency conditions in power systems.
• Package and Mounting — Chip-type radial can for surface-mount applications; dimensions L: 1.0 × D: 0.8 cm with recommended land pattern 8.3 × 8.3 mm. Applicable to automatic mounting machines fed with carrier tape.
• Polarization & Leakage — Polarized electrolytic construction; leakage current after 2 minutes at rated voltage and 20°C is not more than 0.01CV or 3 µA (whichever is greater), per datasheet.
• Standards & Compliance — RoHS compliant and AEC-Q200 qualified for automotive-grade reliability (see datasheet for qualification details).

Typical Applications

• Automotive Electronics — Suitable for electronic modules where AEC-Q200 qualification and −55°C to +105°C operation are required.
• High-Density Surface-Mount PCBs — Chip-type radial-can SMD package and compact footprint support power bulk and decoupling in space-constrained board designs.
• Automated Assembly Lines — Designed for use with carrier-tape feed for reliable placement by automatic mounting equipment.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q200 status provides documented qualification for use in automotive electronic designs.
• Wide Temperature Range: Operation from −55°C to +105°C supports thermal margins for harsh-environment electronics.
• Low Impedance: 300 mΩ impedance reduces voltage ripple and improves transient response in compact power stages.
• Compact SMD Form Factor: 1.0 × 0.8 cm body with 8.3 × 8.3 mm land pattern minimizes board area while enabling surface-mount assembly.
• High Ripple Capability: Specified ripple currents at 120 Hz and 10 kHz support both low- and high-frequency power conditions.
• Long-Term Endurance: 1000 hours at 105°C endurance rating provides defined performance limits for high-temperature longevity planning.

Why Choose UWG0J331MNL1GS?

The UWG0J331MNL1GS provides a balance of compact package size, low impedance, and defined high-temperature endurance for engineers designing reliable power subsystems. With AEC-Q200 qualification, RoHS compliance, and carrier-tape compatibility, it fits into automated production flows for automotive and industrial assemblies.

This capacitor is well suited to designers who need verified thermal performance and predictable ripple handling in confined board space, offering clear specification limits for endurance and leakage current straight from the datasheet.

Request a quote or contact sales to discuss availability, lead times, and sample requirements for UWG0J331MNL1GS.