UWG1A101MCL1GS

The UWG1A101MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor from Nichicon engineered for surface-mount applications. It delivers 100 µF capacitance at 10 V in a compact SMD can (L: 6.2 × D: 8 mm) and is designed for high-density PC boards and automatic placement from carrier tape.

Built for demanding thermal environments, this part operates from −55 °C to +105 °C, meets AEC-Q200 qualification, and is RoHS compliant—making it suitable where long-term reliability and board-level integration are required.

Key Features

• Capacitance & Voltage — 100 µF rated capacitance at 10 V provides bulk energy storage and decoupling in compact SMD form.
• Low Impedance Performance — Specified impedance of 400 mΩ supports effective ripple smoothing and power rail stabilization.
• Ripple Current Capability — Rated for 115 mA at 120 Hz and 230 mA at 10 kHz to handle AC stress in power circuits.
• Temperature & Endurance — Operates from −55 °C to +105 °C with endurance of 1000 hours at 105 °C, suitable for thermally demanding designs.
• AEC-Q200 Qualified — Electronic component qualification for automotive applications is provided (AEC-Q200).
• Surface-Mount, Carrier-Tape Compatible — Chip-type can package designed for surface mounting on high-density PCBs and automated placement from carrier tape.
• Polarized with Standard Tolerance — Polar electrolytic design with capacitance tolerance of −20% to +20%.
• RoHS Compliant — Meets RoHS directive (2011/65/EU, (EU)2015/863) for restricted substances.
• Leakage Current Specification — After 2 minutes at rated voltage and 20 °C, leakage current is ≤ 0.01CV or 3 µA (whichever is greater), enabling predictable standby behavior.

Typical Applications

• Automotive electronic modules — AEC-Q200 qualification and wide temperature range make this capacitor suitable for power decoupling and smoothing in automotive control units and subsystems.
• High-density PCB power rails — Chip-type SMD can and carrier-tape compatibility enable automated placement on compact, densely populated boards for local bulk decoupling.
• Temperature-challenged electronics — Operation from −55 °C to +105 °C and 1000-hour endurance at 105 °C support use in equipment exposed to wide thermal swings.

Unique Advantages

• Compact, board-friendly package — 6.2 × 8 mm chip can fits high-density layouts while supporting automated assembly from carrier tape.
• Proven thermal endurance — 1000 hours at 105 °C provides a measurable reliability baseline for lifecycle planning.
• Automotive-grade qualification — AEC-Q200 status helps reduce qualification burden for vehicle electronics designs.
• Predictable leakage behavior — Clear leakage current limit (0.01CV or 3 µA) supports low-current and standby designs.
• Broad ripple handling — Dual ripple current ratings at 120 Hz and 10 kHz enable use across a range of switching and AC conditions.
• Regulatory compliance — RoHS compliance simplifies global regulatory adherence for assembled products.

Why Choose UWG1A101MCL1GS?

UWG1A101MCL1GS combines compact SMD packaging, low impedance (400 mΩ), and robust thermal endurance to deliver reliable bulk decoupling and smoothing in space-constrained power designs. Its AEC-Q200 qualification and wide operating temperature range make it a practical choice for automotive and other temperature-challenged applications that require predictable performance and automated assembly.

Manufactured by Nichicon, this capacitor provides verifiable electrical and environmental specifications—capacitance, ripple current, leakage limits, and endurance—so engineers and procurement can evaluate suitability against system requirements with confidence.

To request a quote or submit an RFQ for UWG1A101MCL1GS, please reach out to your procurement team or sales channel to begin pricing and availability inquiries.