UWG1A151MCL1GS

The UWG1A151MCL1GS is a chip-type aluminum electrolytic capacitor engineered for surface-mount applications. It delivers 150 µF at 10 V in a compact radial can SMD package designed for high-density PC boards and automated assembly.

With a wide operating temperature range of −55 to +105°C, AEC-Q200 qualification and RoHS compliance, this part targets demanding environments that require low impedance, reliable long-term performance and compatibility with carrier-tape fed pick-and-place processes.

Key Features

• Capacitance & Voltage — 150 µF rated capacitance at 10 V, with a tolerance of −20% to +20%.
• Low Impedance — Specified impedance of 400 mΩ to support decoupling and bulk energy storage in compact layouts.
• Ripple Current — Rated ripple currents of 115 mA at 120 Hz and 230 mA at 10 kHz for AC ripple handling across low and high frequency ranges.
• Wide Temperature Range — Operating range from −55 to +105°C for use in thermally demanding systems.
• High-Temperature Endurance — Rated lifetime of 1000 hours at 105°C, with endurance specifications for capacitance, tan δ and leakage current after recovery to 20°C.
• Leakage Current — After 2 minutes’ application of rated voltage at 20°C, leakage current is specified as not more than 0.01CV or 3 µA (whichever is greater).
• Automotive-Grade Reliability — AEC-Q200 qualified for use in automotive electronic applications.
• Surface-Mount, SMT Assembly Ready — Chip-type, carrier-tape compatible and designed for automatic mounting machines; package case: radial, can – SMD.
• Compact Package — Component dimensions L: 6.2 × D: 8 mm with recommended surface-mount land size L: 8.3 × W: 8.3 mm; top marking is black print on the case.
• Regulatory Compliance — RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — Designed and qualified (AEC-Q200) for electronic control modules and subsystems that require board-level, surface-mount capacitance in automotive environments.
• High-Density PCBs — Chip-type SMD format ideal for power decoupling and energy storage where board space is constrained on densely populated assemblies.
• Automated Assembly Lines — Carrier-tape compatibility and SMT package form factor enable efficient placement in high-volume manufacturing.

Unique Advantages

• Reliable across wide temperatures — Operation from −55 to +105°C plus 1000 hours endurance at 105°C provides predictable behavior in harsh thermal conditions.
• Automotive qualification — AEC-Q200 qualification aligns the part with automotive design and qualification workflows for greater confidence in reliability.
• Low-impedance performance — 400 mΩ impedance supports effective smoothing and transient response in compact power delivery networks.
• SMT-ready packaging — Chip-type radial can SMD and carrier-tape compatibility reduce handling complexity and streamline automated placement.
• Defined leakage limits — Leakage current spec (0.01CV or 3 µA after 2 minutes at 20°C) simplifies leakage budgeting for precision designs.
• RoHS compliance — Conforms to current RoHS directives for regulatory alignment in commercial and automotive products.

Why Choose UWG1A151MCL1GS?

UWG1A151MCL1GS combines a compact chip-type SMD form factor with automotive-grade qualification and a wide operating temperature window, making it well suited for engineers specifying robust, low-impedance aluminum electrolytic capacitance on dense PCBs. Its ripple current capability and defined leakage and endurance characteristics provide predictable electrical behavior for long-term designs.

This capacitor is a practical choice for designers and procurement teams seeking a RoHS-compliant, AEC-Q200 qualified SMD electrolytic capacitor that integrates smoothly into automated assembly lines and supports demanding thermal and electrical environments.

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