UWG1C100MCL1GB

The UWG1C100MCL1GB is a chip-type aluminum electrolytic capacitor from Nichicon’s UWG series, designed for surface mounting on high-density PC boards. It delivers a 10 µF capacitance at a 16 V rating with low impedance characteristics and is targeted at applications requiring wide temperature operation and robust qualification.

This part is AEC-Q200 qualified, RoHS compliant, and engineered for automated assembly (carrier-tape feed), making it suitable for demanding electronics designs that require reliable SMD capacitors across a broad temperature range.

Key Features

• Electrical Performance — 10 µF capacitance with a 16 V rated voltage and a tolerance of ±20% (–20% ~ 20%). Impedance specified as 3 Ω for this part.
• Low Impedance Design — Built as a low-impedance chip-type electrolytic to support ripple handling; specified ripple currents: 30 mA at 120 Hz and 60 mA at 10 kHz.
• Wide Temperature Range — Operates from –55 °C to +105 °C, with endurance rated for 1000 hours at 105 °C.
• Surface-Mount Package — Chip-style aluminum can for SMD use; package dimensions L: 5.4 × D: 4 mm and recommended land size L: 4.3 × W: 4.3 mm.
• Automated Assembly Ready — Designed for surface mounting on high-density PC boards and applicable to automatic mounting machines fed with carrier tape.
• Reliability & Compliance — AEC-Q200 qualified and compliant with RoHS directives (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — Suitable for electronic modules and subsystems that require components qualified to AEC-Q200 and operation across –55 °C to +105 °C.
• High-Density SMD Designs — Intended for compact, surface-mounted PCBs where automatic placement and carrier-tape feeding are required.
• Temperature-Stringent Environments — Use in systems that demand reliable capacitor performance after extended exposure to high temperatures (1000 h at 105 °C).

Unique Advantages

• AEC-Q200 Qualification — Provides documented qualification for designs that require automotive-grade component standards.
• Wide Operating Temperature — Supports application environments from –55 °C to +105 °C, reducing the need for additional thermal derating in many designs.
• Assembly-Friendly Form Factor — Chip SMD can and carrier-tape compatibility streamline placement on automated production lines for high-volume manufacturing.
• Compact Footprint — Small L: 5.4 × D: 4 mm package and defined land pattern enable high-density board layouts.
• RoHS Compliant — Meets current RoHS requirements for lead-free and restricted-substance compliance.

Why Choose UWG1C100MCL1GB?

UWG1C100MCL1GB combines a compact chip SMD package with low impedance behavior and a wide –55 °C to +105 °C operating range, backed by AEC-Q200 qualification. It is an appropriate choice for engineers specifying robust electrolytic capacitors for high-density boards and automated assembly in temperature-demanding environments.

This part is well suited to designs where a verified automotive-grade SMD capacitor with clear mechanical and electrical specifications (10 µF, 16 V, defined land size and package dimensions) is required, offering predictable endurance and compliance for long-term deployment.

If you would like a formal quote or have questions about integrating UWG1C100MCL1GB into your design, please request a quote or contact sales for pricing and availability.