UWG1A330MCL1GB

The UWG1A330MCL1GB is a chip-type aluminum electrolytic capacitor designed for surface mounting on high-density PCBs. It delivers a compact, polarized energy-storage solution with a rated capacitance of 33 µF at 10 V and is engineered for demanding temperature environments from -55 °C to +105 °C.

Built for automated assembly and long-term operation, this part is RoHS compliant and AEC-Q200 qualified, offering a balance of low impedance, controlled ripple handling, and automotive-grade qualification for designs that require robustness across temperature and manufacturing throughput.

Key Features

• Electrical Performance — 33 µF capacitance at 10 V with ±20% tolerance; low impedance specified at 1.8 Ω for stable performance in decoupling and smoothing roles.
• Temperature & Lifetime — Rated for operation from -55 °C to +105 °C with a guaranteed endurance of 1000 hours at 105 °C, supporting long-term reliability in high‑temperature environments.
• Ripple Handling — Specified ripple capability of 47.5 mA at 120 Hz and 95 mA at 10 kHz, enabling use where AC ripple and switching noise must be mitigated.
• Package & Mounting — Chip (can) SMD construction sized L: 5.4 × D: 5 mm; surface-mount land recommended L: 5.3 × W: 5.3 mm. Applicable to automatic mounting machines fed with carrier tape for high-volume assembly.
• Compliance & Qualification — RoHS compliant and AEC-Q200 qualified, meeting environmental and automotive-grade reliability requirements.
• Polarized Design — Polarized aluminum electrolytic construction for bulk energy storage and filtering in DC circuits.

Typical Applications

• Automotive Electronics — AEC-Q200 qualification and wide temperature range make the UWG1A330MCL1GB suitable for electronic control modules and other in-vehicle power systems that require robust, board-mounted capacitance.
• Power Supply Filtering — Low impedance and specified ripple current make this capacitor suitable for smoothing and decoupling in compact power rails on high-density PCBs.
• High-Volume Surface-Mount Production — Designed for carrier-tape automated placement, easing integration into automated assembly lines for consumer and industrial products with tight board-space constraints.

Unique Advantages

• Wide Operating Temperature: -55 °C to +105 °C rating supports designs exposed to extreme ambient conditions.
• Automotive-Grade Reliability: AEC-Q200 qualification provides confidence for use in transport and other demanding applications.
• Compact SMD Footprint: Small 5.4 × 5 mm package and defined land pattern allow high-density PCB layouts without sacrificing capacitance.
• Manufacturing Friendly: Compatible with carrier-tape automated mounting to streamline high-volume production and reduce assembly cycle time.
• Verified Endurance: 1000-hour life at 105 °C offers measurable long-term performance for thermal stress conditions.

Why Choose UWG1A330MCL1GB?

The UWG1A330MCL1GB combines compact chip-style SMD packaging with specifications targeted at robust, temperature-tolerant designs. With low impedance, defined ripple-current ratings, and a 1000-hour endurance at 105 °C, it is positioned for engineers seeking reliable bulk capacitance and filtering on dense PCBs, including automotive applications where AEC-Q200 qualification is required.

Its carrier-tape compatibility and RoHS compliance help simplify procurement and manufacturing for teams focused on scalable production and regulatory conformance, while the polarized aluminum design delivers predictable performance for DC power systems.

If you would like a quote or additional purchasing information for UWG1A330MCL1GB, please request a quote or contact sales for availability and lead‑time details.