UWG1A102MNL1GS

The UWG1A102MNL1GS is a chip‑type aluminum electrolytic capacitor from Nichicon’s UWG series, designed for surface mounting on high‑density printed circuit boards. It delivers a 1 mF capacitance at a 10 V rating in a compact radial can SMD package optimized for automated assembly.

Engineered for demanding temperature environments and automotive applications, the part combines low impedance characteristics with AEC‑Q200 qualification and RoHS compliance to support reliable power decoupling and filtering across a wide operating range.

Key Features

• Electrical Performance — 1 mF capacitance at 10 V with a capacitance tolerance of ±20% (measured at 120 Hz, 20°C). Rated impedance of 150 mOhm for effective decoupling and smoothing.
• Ripple Handling — Specified ripple currents of 335 mA at 120 Hz and 670 mA at 10 kHz to address both low‑ and high‑frequency ripple conditions.
• Temperature and Endurance — Wide operating temperature range of −55°C to +105°C and endurance rated to 1000 hours at 105°C, with specified limits for capacitance change, tan δ, and leakage after the endurance test.
• Reliability & Qualification — AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863), supporting use in regulated environments and applications requiring recognized component qualifications.
• Surface‑Mount Package — Chip‑type radial can SMD (L × D ≈ 1 × 1 cm) designed for placement on high‑density PCBs and compatible with automatic mounting machines fed with carrier tape; recommended land size L: 1.03 × W: 1.03 cm.
• Polarized Design — Polarized aluminum electrolytic construction for bulk energy storage and smoothing in DC circuits.

Typical Applications

• Automotive Electronics — AEC‑Q200 qualification and −55°C to +105°C operation make the UWG1A102MNL1GS suitable for use in automotive electronic modules that require robust bulk capacitance and ripple suppression.
• High‑Density Surface‑Mount Assemblies — Chip‑type SMD package and carrier‑tape compatibility enable automated placement on compact PCBs where board space and assembly efficiency are priorities.
• Power Filtering and Decoupling — 1 mF capacitance and low impedance support smoothing and decoupling tasks in DC power rails and local energy buffering on control boards.

Unique Advantages

• Compact, assembly‑friendly package — Small L × D footprint (~1 × 1 cm) and carrier‑tape compatibility reduce board area and streamline automated placement.
• Wide temperature capability — Operates from −55°C to +105°C and is endurance‑rated to 1000 hours at 105°C, providing predictable performance in thermally challenging environments.
• Qualified for demanding applications — AEC‑Q200 qualification and RoHS compliance support regulated design requirements and long‑term reliability goals.
• Clear performance specifications — Defined impedance (150 mOhm), ripple current ratings (335 mA @120 Hz, 670 mA @10 kHz), and leakage/tan δ limits enable straightforward component selection and system modeling.
• Polarized electrolytic energy storage — High capacitance in a small SMD can helps reduce the number of components needed for bulk filtering compared with smaller discrete capacitors.

Why Choose UWG1A102MNL1GS?

UWG1A102MNL1GS positions itself as a compact, low‑impedance aluminum electrolytic solution tailored for surface‑mount, high‑density board designs where wide temperature range and qualification matter. Its combination of 1 mF capacitance at 10 V, specified impedance and ripple ratings, and AEC‑Q200 qualification make it a practical choice for engineers targeting robust automotive and industrial electronics.

This part is well suited to designs that require reliable bulk capacitance with predictable thermal and electrical behavior, streamlined automated assembly, and compliance with RoHS and established qualification standards.

To request a quote or submit a technical inquiry for UWG1A102MNL1GS, please reach out to our sales team with your quantity and delivery requirements.