UWG0J680MCL1GB
| Part Description |
68 µF 6.3 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 633 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UWG |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 68 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 5.7 mm | HTS Code | 8532.22.0020 | ||
| Impedance | 1 Ohm | Lead Spacing | N/A | Lifetime @ Temp | 1000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 140 mA @ 10 kHz | Ripple Current Low Frequency | 70 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.4 x 6.3 mm | Surface Mount Land Size | 6.6 x 6.6 mm | ||
| Tolerance | -20%~20% | Voltage | 6.3 V |
Overview of UWG0J680MCL1GB – Surface‑Mount Low‑Impedance Aluminum Electrolytic Capacitor, 68 µF / 6.3 V
The UWG0J680MCL1GB is a chip‑type, surface‑mount aluminum electrolytic capacitor designed for low impedance applications. It delivers 68 µF capacitance at a 6.3 V rating in a compact φ6.3 × 5.4 mm can with embossed carrier taping for automated placement.
Engineered for demanding temperature and reliability conditions, this AEC‑Q200 qualified component supports an operating range of −55 °C to 105 °C and an endurance rating of 1000 hours at 105 °C, making it suitable for high‑density, high‑reliability electronics including automotive systems.
Key Features
- Capacitance & Voltage — 68 µF nominal capacitance with a rated voltage of 6.3 V and ±20% tolerance at 120 Hz, 20 °C.
- Low‑Impedance Chip Type — Series designed as a low‑impedance chip-type aluminum electrolytic; published impedance value available as 1 Ω.
- Loss Angle — Tangent of loss angle (tan δ) specified at 0.26 (max.) for 6.3 V, measured at 20 °C and 120 Hz.
- Ripple Current Capability — Low‑frequency ripple current of 70 mA at 120 Hz and high‑frequency ripple current of 140 mA at 10 kHz to support decoupling and smoothing in power circuits.
- Leakage Current — Low leakage current specified at 4.284 µA (measured after 2 minutes' application of rated voltage conditions are defined in the series specifications).
- Wide Temperature & Endurance — Operating temperature range −55 °C to 105 °C with endurance specified as 1000 hours at 105 °C under rated voltage.
- Package & Mounting — Surface‑mount radial can (SMD) size φ6.3 × 5.4 mm, recommended PCB land size 6.6 × 6.6 mm, and supplied on embossed carrier tape for automated pick‑and‑place.
- Standards & Compliance — RoHS directive compliant and AEC‑Q200 qualified for use in applications requiring that qualification.
Typical Applications
- Automotive electronics — Bulk decoupling and power‑rail smoothing in control modules and sensors where AEC‑Q200 qualification and wide temperature tolerance are required.
- Power management — Input/output filtering and energy storage for DC/DC converters and regulator front‑ends that demand low impedance and controlled ripple handling.
- Embedded systems — Local decoupling on high‑density PCBs to stabilize supply rails in compact designs with automated assembly.
Unique Advantages
- Compact, high‑value capacitance: 68 µF in a φ6.3 × 5.4 mm package conserves board space while providing substantial decoupling capacity.
- Designable ripple handling: Specified ripple currents at both low and high frequencies (70 mA at 120 Hz, 140 mA at 10 kHz) let designers assess thermal and AC stress for power‑filter designs.
- Qualified reliability: AEC‑Q200 qualification and 1000 hours at 105 °C endurance provide traceable reliability for demanding environments.
- Assembly‑friendly packaging: Embossed carrier taping and an industry standard land size (6.6 × 6.6 mm) support automated placement and established PCB layout practices.
- Low leakage and controlled dissipation: Low leakage current (4.284 µA) and a defined tan δ facilitate predictable behavior in standby and bias applications.
Why Choose UWG0J680MCL1GB?
UWG0J680MCL1GB combines a chip‑type low‑impedance topology with automotive‑grade qualification and a compact footprint, offering a reliable solution for power decoupling and smoothing in constrained, high‑temperature environments. Its rated endurance and thermal performance make it a practical choice for engineers building robust, long‑life electronics.
This part is well suited to design teams needing a verified, serviceable aluminum electrolytic capacitor that integrates into automated manufacturing flows while meeting stringent temperature and qualification requirements.
Request a quote or contact sales to discuss lead times, availability, and volume pricing for UWG0J680MCL1GB.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016