UWG1H3R3MCL1GB

The UWG1H3R3MCL1GB is a chip-type aluminum electrolytic capacitor designed for surface-mount use on high-density PC boards. It combines low-impedance construction with a compact SMD can package to support power decoupling and smoothing in space-constrained assemblies.

Built for demanding environments, this part operates from −55°C to +105°C, is RoHS compliant and AEC-Q200 qualified, and is suitable for automatic placement using carrier tape — making it appropriate for automotive and other reliability-focused applications.

Key Features

• Electrical Characteristics — 3.3 µF capacitance at a 50 V rated voltage, polarized, with ±20% tolerance and a specified impedance of 5 Ω.
• Low Impedance Design — Chip-type, low-impedance construction for improved decoupling and transient handling in power rails.
• Wide Temperature Range — Rated for operation from −55°C to +105°C to support extended thermal environments.
• Reliability & Endurance — AEC-Q200 qualified; endurance validated to meet specified limits after 1000 hours at 105°C (capacitance change within ±20%, tan δ within 200% of initial specified value, leakage current within initial spec).
• Package & Mounting — Chip-type radial can SMD package sized L: 5.4 × D: 4 mm, surface-mount land size L: 4.3 × W: 4.3 mm; designed for automatic mounting machines fed with carrier tape.
• Defined Ripple Performance — Ripple current ratings of 15 mA at 120 Hz and 30 mA at 10 kHz provide clear limits for power-design considerations.
• Environmental Compliance — Compliant with the RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive electronics — Suitable for control modules and electronic subsystems where AEC-Q200 qualification and a −55°C to +105°C range are required.
• High-density SMD power boards — Chip-type SMD package and carrier-tape compatibility enable automated placement on compact PCBs.
• Power rail decoupling and smoothing — Low impedance and defined ripple current ratings make this part suitable for local decoupling on 50 V rails.

Unique Advantages

• Wide operational temperature window — −55°C to +105°C rating supports designs that must tolerate extreme thermal conditions.
• AEC-Q200 qualification — Adds a verified level of reliability for automotive and other demanding applications.
• Compact SMD form factor — Small L: 5.4 × D: 4 mm footprint and 4.3 × 4.3 mm land pattern reduce PCB area and support high-density layouts.
• Low-impedance electrical performance — 5 Ω impedance and controlled ripple current ratings help stabilize power rails and improve transient response.
• Manufacturing-friendly — Designed for automatic mounting machines fed with carrier tape, enabling efficient assembly on production lines.
• Regulatory compliance — RoHS compliance aligns with modern environmental requirements.

Why Choose UWG1H3R3MCL1GB?

UWG1H3R3MCL1GB delivers a compact, low-impedance SMD aluminum electrolytic solution that balances electrical performance with automotive-grade reliability. Its combination of a 3.3 µF / 50 V rating, defined ripple specifications, AEC-Q200 qualification, and a −55°C to +105°C operating range makes it well suited for engineers designing robust power systems on space-constrained PCBs.

Manufactured by Nichicon and designed for automated assembly, this part is appropriate for teams specifying components for long-term, reliability-focused designs where environmental compliance and predictable endurance at elevated temperature are important.

Request a quote or contact sales to discuss availability, pricing, and lead times for UWG1H3R3MCL1GB.