UWG1H330MNL1GS

The UWG1H330MNL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount applications. With a 33 µF capacitance at 50 V rating and AEC-Q200 qualification, it targets reliable use in automotive and high-density PCB environments where compact, durable SMD power decoupling is required.

Key value comes from its low impedance, wide operating temperature range, and assembly-friendly packaging—combining electrical performance with production-ready features such as embossed carrier taping for automated mounting.

Key Features

• Capacitance & Tolerance — 33 µF with ±20% tolerance at 120 Hz, 20°C, suitable for bulk decoupling and smoothing tasks.
• Voltage Rating — 50 V rated voltage for higher-voltage power rails where compact SMD capacitance is required.
• Low Impedance Performance — Specified impedance of 600 mΩ, providing reduced voltage ripple and improved transient response.
• Ripple Current Capability — 150 mA at 120 Hz and 300 mA at 10 kHz, enabling effective handling of both low- and high-frequency ripple currents.
• Reliability & Qualification — AEC-Q200 qualified with endurance of 1000 hours at 105°C; leakage and tan δ performance meet datasheet endurance criteria after rated stress.
• Wide Temperature Range — Operates from −55°C to +105°C for use in thermally demanding applications.
• Surface-Mount Chip Package — φ8 × 10 L radial can SMD construction with surface-mount land size 8.3 × 8.3 mm and embossed carrier taping for automated assembly.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Automotive Electronics — Designed for automotive systems that require components meeting AEC-Q200 qualification and extended temperature operation.
• Power Supply Filtering — Used for bulk decoupling and smoothing on 50 V power rails where low impedance and defined ripple handling are required.
• High-Density Surface-Mount Boards — Chip-type SMD format and compact φ8×10L size make it suitable for dense PCB layouts.
• Automated Mass Production — Embossed carrier taping and surface-mount compatibility support pick-and-place assembly and high-volume manufacturing.

Unique Advantages

• AEC-Q200 Qualification: Provides a recognized level of automotive-grade reliability for designs that require component-level qualification.
• Low Impedance (600 mΩ): Improves ripple suppression and transient performance for power circuits.
• Dual-Frequency Ripple Handling: Rated ripple current of 150 mA (120 Hz) and 300 mA (10 kHz) supports a range of power-regulation and switching environments.
• High-Temperature Endurance: 1000 hours at 105°C endurance rating supports sustained operation in elevated temperature conditions.
• Assembly-Ready Packaging: Embossed carrier tape format and surface-mount design streamline automated mounting and reduce assembly overhead.
• Compact SMD Form Factor: φ8 × 10 L radial can SMD package with defined land pattern (8.3 × 8.3 mm) enables space-efficient board layouts.

Why Choose UWG1H330MNL1GS?

The UWG1H330MNL1GS combines low-impedance performance, robust thermal endurance, and AEC-Q200 qualification in a compact surface-mount chip package. It is well suited to designs that demand reliable power decoupling on 50 V rails in thermally and mechanically constrained environments.

Engineers and procurement teams will find value in its production-ready packaging, specified ripple performance, and clear endurance data—making it a practical choice for automotive-grade and industrial SMD assemblies where long-term stability and automated manufacturing are priorities.

For pricing, lead-time information, or to request a quote for UWG1H330MNL1GS, please submit an inquiry to receive detailed commercial and availability information.