UWG1H4R7MCL1GB
| Part Description |
4.7 µF 50 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 650 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UWG |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 4.7 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 5.7 mm | HTS Code | 8532.22.0020 | ||
| Impedance | 3 Ohm | Lead Spacing | N/A | Lifetime @ Temp | 1000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 50 mA @ 10 kHz | Ripple Current Low Frequency | 25 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.4 x 5 mm | Surface Mount Land Size | 5.3 x 5.3 mm | ||
| Tolerance | -20%~20% | Voltage | 50 V |
Overview of UWG1H4R7MCL1GB – Chip Type Aluminum Electrolytic Capacitor, 4.7 µF, 50 V
The UWG1H4R7MCL1GB is a chip-type, low-impedance aluminum electrolytic capacitor from Nichicon, specified at 4.7 µF and 50 V. It is a polarized, surface-mount radial can (SMD) device engineered for use on high-density printed circuit boards and automated assembly lines.
Designed for robust operating environments, this part supports a wide temperature range from −55 °C to +105 °C, carries AEC-Q200 qualification, and is RoHS compliant—addressing reliability and regulatory needs for demanding applications.
Key Features
- Capacitance & Voltage: 4.7 µF rated capacitance at 50 V for compact energy storage in SMD form.
- Low Impedance: Chip-type, low-impedance construction with an impedance of 3 Ω for stable performance in the targeted frequency ranges.
- Temperature Performance: Wide operating range from −55 °C to +105 °C and endurance rated for 1000 hours at 105 °C.
- Qualification & Compliance: AEC-Q200 qualified and RoHS compliant to support automotive and regulated applications.
- Mounting & Assembly: Surface-mount radial can (SMD) package designed for high-density PCBs and compatible with automatic mounting machines fed by carrier tape.
- Mechanical Footprint: Compact dimensions L: 5.4 × D: 5 mm with recommended surface-mount land size L: 5.3 × W: 5.3 mm and a maximum seated height of 5.4 mm.
- Tolerance & Polarization: Capacitance tolerance ±20% and polarized construction.
- Leakage & Ripple Characteristics: Leakage current specification: after 2 minutes at 20 °C, ≤ 0.01CV or 3 µA (whichever is greater); ripple current 25 mA at 120 Hz and 50 mA at 10 kHz.
Typical Applications
- Automotive Electronics: Suited for electronic modules requiring AEC-Q200 qualification and extended temperature range.
- High-density Surface-mount PCBs: Compact chip-type package designed for integration on space-constrained boards.
- Automated Assembly Lines: Built for compatibility with automatic mounting machines fed by carrier tape to streamline production.
Unique Advantages
- Wide temperature capability: −55 °C to +105 °C rating supports designs exposed to extreme ambient conditions.
- Automotive-grade qualification: AEC-Q200 status provides specified qualification for automotive use cases that demand component-level reliability.
- Compact SMD form factor: Small 5.4 × 5 mm footprint and SMD radial-can package enable high-density layout and reduced board space.
- Production-friendly packaging: Compatibility with carrier-tape automatic mounting machines reduces handling and speeds assembly.
- Designed for durability: Endurance specified at 1000 hours at 105 °C for predictable life performance under elevated temperature stress.
- Measured electrical limits: Explicit leakage current and ripple current ratings provide clear design parameters for power-management and filtering circuits.
Why Choose UWG1H4R7MCL1GB?
UWG1H4R7MCL1GB combines Nichicon’s chip-type, low-impedance aluminum electrolytic technology with automotive-grade qualification and RoHS compliance, making it a solid choice for engineers designing compact, high-reliability modules. Its temperature range, endurance rating, and assembly compatibility position it for use where board space, automated production, and long-term stability matter.
This capacitor is ideal for designers and procurement teams seeking a verified SMD electrolytic solution for automotive and other demanding environments where predictable electrical limits and production-ready packaging reduce design and manufacturing risk.
Request a quote or contact sales to discuss pricing, availability, and sample requests for UWG1H4R7MCL1GB.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016