UWG1V100MCL1GB

The UWG1V100MCL1GB is a chip-type aluminum electrolytic capacitor designed for surface-mount applications. It delivers a 10 µF capacitance at 35 V in a compact φ5 × 5.4 mm package and is optimized for high-density PC boards and automated assembly.

This part is AEC-Q200 qualified and RoHS compliant, offering low impedance characteristics and a wide operating temperature range of −55 °C to 105 °C with 1000 hours endurance at 105 °C.

Key Features

• Chip-type, Low Impedance Designed as a chip-style aluminum electrolytic capacitor with a low impedance construction; specified DC impedance is 1.8 Ω.
• Capacitance & Tolerance 10 µF capacitance with ±20% tolerance (measured at 120 Hz, 20 °C).
• Voltage Rating Rated voltage 35 V.
• Loss Tangent (tan δ) tanδ (DF) specified at 0.12 (measurement condition: 20 °C, 120 Hz) for the 35 V rating.
• Ripple Current Low-frequency ripple current 47.5 mA at 120 Hz and high-frequency ripple current 95 mA at 10 kHz.
• Leakage Current Specified leakage current 3.5 µA.
• Temperature Range & Endurance Operating range −55 °C to 105 °C with rated endurance of 1000 hours at 105 °C.
• Compact SMD Package Package size φ5 × 5.4 mm (L: 5.4 × D: 5 mm) with surface-mount land recommendation L: 5.3 × W: 5.3 mm; package style is radial, can - SMD.
• Pick-and-Place Ready Supplied in embossed carrier taping suitable for automatic mounting machines.
• Quality & Compliance AEC-Q200 rated and RoHS compliant; product status: mass production.

Typical Applications

• Automotive electronics — AEC-Q200 qualification and wide operating temperature range (−55 °C to 105 °C) support use in automotive electronic modules.
• High-density surface-mount PCBs — Chip-type SMD format and compact φ5 × 5.4 mm footprint suit tight-layout power or board-level designs.
• Automated assembly lines — Embossed carrier taping and compatibility with automatic mounting machines enable efficient pick-and-place production.
• Temperature-challenged environments — Specified endurance of 1000 hours at 105 °C supports applications that require extended operation at elevated temperatures.

Unique Advantages

• AEC-Q200 Qualification: Provides an explicit quality classification for automotive-grade applications where that certification is required.
• Compact, Chip-Type SMD: φ5 × 5.4 mm package reduces board area while maintaining a 10 µF capacitance for space-constrained designs.
• Low Loss and Low Impedance: tanδ of 0.12 (35 V, 120 Hz, 20 °C) and 1.8 Ω impedance support stable AC performance within specified conditions.
• Measured Ripple Capability: Defined ripple current ratings (47.5 mA at 120 Hz, 95 mA at 10 kHz) enable straightforward thermal and performance budgeting.
• Robust Thermal Endurance: Rated for 1000 hours at 105 °C, enabling predictable long-term behavior in elevated-temperature applications.
• Production-Ready Packaging: Embossed carrier taping supports automated placement to streamline manufacturing.

Why Choose UWG1V100MCL1GB?

UWG1V100MCL1GB combines a compact chip-type SMD package with measured electrical characteristics—10 µF at 35 V, low tanδ, defined ripple current ratings, and low impedance—making it a practical choice where board space, thermal endurance, and predictable performance matter. Its AEC-Q200 rating and RoHS compliance support deployment in applications requiring recognized quality and environmental compliance.

This capacitor is suited to design teams and procurement engineers building surface-mount assemblies for automotive and other temperature-challenged environments who need a production-ready, pick-and-place compatible electrolytic capacitor with documented endurance and electrical parameters.

Request a quote or contact sales to discuss availability, lead times, and volume pricing for the UWG1V100MCL1GB.