UWG1H2R2MCL1GB

The UWG1H2R2MCL1GB is a chip‑type aluminum electrolytic capacitor designed for surface mounting on high‑density PCBs. It delivers low impedance performance in a compact SMD can package and is suitable for automated assembly using carrier tape.

Engineered for demanding operating environments, this part supports a wide temperature range and carries AEC‑Q200 qualification and RoHS compliance, making it appropriate for automotive electronics and other applications requiring reliable, rugged capacitors.

Key Features

• Core Type – Low impedance chip design Chip‑type aluminum electrolytic construction optimized for low impedance performance.
• Electrical — Capacitance & Voltage 2.2 µF rated capacitance at 50 V with ±20% tolerance.
• Impedance & Loss Specified impedance of 5 Ω and a maximum tan δ of 0.12 at the 50 V rating (measured at 120 Hz, 20 °C).
• Ripple Current Rated for 15 mA at 120 Hz and 30 mA at 10 kHz to support smoothing and decoupling duties in compact power circuits.
• Temperature & Endurance Operates from −55 °C to +105 °C with endurance validated by 1000 hours at 105 °C under rated voltage (capacitance change within ±20%, tan δ ≤200% of initial spec, leakage current ≤ initial specified value).
• Reliability & Compliance AEC‑Q200 qualified and RoHS compliant for use in regulated and automotive applications.
• Mounting & Assembly Surface‑mount radial can (SMD) package designed for high‑density PCBs and automatic mounting machines fed with carrier tape.
• Leakage Current After 2 minutes at rated voltage and 20 °C, leakage current is ≤0.01CV or 3 µA, whichever is greater.
• Soldering Robustness Meets resistance to soldering heat: kept on a 250 °C hot plate for 30 seconds with capacitance change within ±10% and no increase in tan δ or leakage current beyond initial specifications.

Typical Applications

• Automotive electronics Suitable for use in vehicle electronic modules where AEC‑Q200 qualification and wide temperature performance are required.
• High‑density surface‑mount assemblies Designed for compact PCBs that require SMD electrolytic capacitors for bulk decoupling and smoothing.
• Automated assembly lines Carrier‑tape compatible package for reliable placement with automatic mounting equipment.

Unique Advantages

• Qualified for automotive environments: AEC‑Q200 qualification supports use in vehicle electronics that demand component-level reliability.
• Wide operating temperature range: −55 °C to +105 °C rating enables stable performance across harsh thermal conditions.
• Low impedance performance: The low impedance chip design and specified 5 Ω impedance help improve transient response and reduce voltage ripple in power rails.
• Assembly‑friendly package: Surface‑mount radial can packaged for carrier‑tape handling simplifies automated placement on dense PCBs.
• Proven endurance and solder robustness: Endurance test of 1000 hours at 105 °C and soldering heat resistance at 250 °C for 30 seconds provide predictable long‑term behavior.
• Regulatory compliance: RoHS compliance supports use in regulated markets and streamlined product compliance efforts.

Why Choose UWG1H2R2MCL1GB?

The UWG1H2R2MCL1GB combines a low‑impedance chip design with automotive‑grade qualification and a wide −55 °C to +105 °C operating range, offering a durable SMD electrolytic solution for compact, assembly‑line production. Its electrical characteristics — 2.2 µF at 50 V with controlled leakage and ripple current ratings — make it suitable for decoupling and smoothing on high‑density boards where reliability is essential.

This part is well suited to engineers and procurement teams designing automotive modules, compact power subsystems, and assemblies requiring automated placement and predictable long‑term behavior under elevated temperature and voltage stress.

Request a quote or submit an inquiry for pricing and lead‑time information to begin integrating UWG1H2R2MCL1GB into your designs.