UWP1H3R3MCL1GB

The UWP1H3R3MCL1GB is a chip-type, bi-polarized aluminum electrolytic capacitor in a surface-mount package designed for high-density PC boards. It delivers 3.3 µF capacitance at a 50 V rating with a compact 5.5 mm length and SMD-compatible package.

Targeted for automotive and other demanding applications, this RoHS-compliant, AEC-Q200 qualified capacitor is engineered for automated assembly and provides a combination of compact size, defined ripple capability, and specified endurance for reliable operation in space-constrained assemblies.

Key Features

• Capacitance & Voltage — 3.3 µF rated capacitance at 50 V, with a tolerance of ±20% (−20% to +20%).
• Bi-Polar Construction — Specified as bi-polarized for use where non-polarized capacitor characteristics are required.
• Surface-Mount Chip Package — Chip-type, SMD radial/can package sized L: 5.4 mm × D: 5 mm with recommended land size L: 5.3 × W: 5.3 mm; designed for high-density PC boards and automated placement from carrier tape.
• AEC-Q200 Qualified — Product data indicates AEC-Q200 qualification for applications requiring that automotive-level stress qualification.
• Operating Range & Endurance — Category temperature range −40 °C to +85 °C with an endurance specification of 1000 hours at 85 °C (with polarity inversion testing described in the series datasheet).
• Ripple Current Ratings — Ripple current capability specified as 17 mA at 120 Hz and 25.5 mA at 10 kHz (part-specific ripple figures from product data).
• Leakage Current Specification — After 2 minutes application of rated voltage at 20 °C, leakage current is ≤ 0.05CV or 10 µA, whichever is greater (series datasheet specification).
• Dissipation Factor (tan δ) — Series-level tan δ maximum for 50 V rating is 0.15 (measured at 120 Hz, 20 °C).
• RoHS Compliance — Compliant to the RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — Suited for automotive systems where AEC-Q200 qualification and RoHS compliance are required.
• High-Density PCB Assemblies — Compact chip-type package is designed for surface mounting on high-density printed circuit boards.
• Automated SMT Production — Applicable to automatic mounting machines and carrier-tape fed placement processes for streamlined assembly.

Unique Advantages

• Automotive-Grade Qualification — AEC-Q200 qualification supports selection for automotive applications and designs requiring established qualification processes.
• Compact Surface-Mount Form Factor — Small L: 5.4 × D: 5 mm chip package and specified land size help save board area on dense assemblies.
• Bi-Polarized Design — Specified as bi-polarized in product data, providing a non-polar capacitor option within an electrolytic form factor.
• Defined Endurance and Temperature Range — 1000 h at 85 °C endurance rating and −40 °C to +85 °C category temperature range give clear expectations for lifecycle and thermal performance.
• Measured Ripple and Leakage Characteristics — Published ripple current values at 120 Hz and 10 kHz plus a defined leakage current limit enable predictable performance in power and decoupling roles.
• RoHS-Compliant Materials — Conforms to RoHS directives noted in the product documentation.

Why Choose UWP1H3R3MCL1GB?

UWP1H3R3MCL1GB combines a compact chip-type SMD package with a bi-polar aluminum electrolytic design and a 50 V, 3.3 µF rating—making it a practical choice for space-constrained, assembly-line production environments. Its AEC-Q200 qualification and RoHS compliance align the component with automotive program requirements and environmental regulations.

With specified ripple current, leakage, dissipation factor, and a defined endurance profile at 85 °C, this capacitor provides transparent, engineering-oriented data points to support system design, qualification planning, and supply decisions for applications that require proven, board-level SMD electrolytic caps.

Request a quote or contact sales to discuss availability, lead times, and how UWP1H3R3MCL1GB can fit into your next high-density or automotive electronics design.