UWP1HR33MCL1GB

The UWP1HR33MCL1GB is a chip‑type aluminum electrolytic capacitor from Nichicon’s UWP series, configured as a bi‑polarized surface‑mount device. With a rated capacitance of 0.33 µF and a 50 V rating, it combines compact dimensions (φ4 × 5.4 mm) with specifications targeted at high‑density PCB designs and automated assembly.

Designed and produced for demanding environments, this part carries AEC‑Q200 qualification, RoHS compliance, and a 1,000‑hour endurance at 85 °C, making it suitable for automotive and other applications where board space, reliability, and automated placement are priorities.

Key Features

• Capacitance & Voltage — 330 nF (0.33 µF) nominal capacitance with a rated voltage of 50 V and a tolerance of ±20% (measured at 120 Hz, 20 °C).
• Bi‑Polar Construction — Bi‑polarized design suitable where non‑polar behavior is required for board‑level applications.
• Compact Chip Package — φ4 × 5.4 mm chip form factor (L: 5.4 × D: 4 mm) optimized for high‑density surface‑mount placement; recommended PCB land size 4.3 × 4.3 mm.
• Automated Assembly Ready — Supplied in embossed carrier taping compatible with automatic mounting machines for efficient pick‑and‑place processing.
• Low Leakage — Specified leakage current up to 10 µA (after 2 minutes’ application of rated voltage at 20 °C) or per the series formula 0.05CV, whichever is greater.
• Ripple Current Ratings — Rated ripple current of 2.8 mA at 120 Hz and 4.2 mA at 10 kHz (frequency dependence documented in series data).
• Wide Operating Temperature — Specified operating range from −40 °C to +85 °C, with endurance tested for 1,000 hours at 85 °C.
• Quality & Compliance — AEC‑Q200 qualified and RoHS compliant, reflecting suitability for automotive and regulated applications.

Typical Applications

• Automotive Electronics — Suited to surface‑mount installation in automotive modules where AEC‑Q200 qualification and compact packaging are required.
• High‑Density PCB Designs — Compact chip form factor for space‑constrained assemblies that require reliable electrolytic capacitance.
• Automated Manufacturing — Packaged in embossed carrier tape for efficient use with pick‑and‑place equipment in volume production environments.

Unique Advantages

• Compact footprint for dense layouts: The φ4 × 5.4 mm chip package and recommended 4.3 × 4.3 mm land pattern enable integration into tight board real estate.
• Automotive‑grade reliability: AEC‑Q200 qualification and a 1,000‑hour endurance at 85 °C provide documented performance for automotive and high‑reliability applications.
• Bi‑polarized flexibility: The bi‑polar construction supports applications where non‑polar operation is needed without requiring multiple discrete parts.
• Assembly efficiency: Embossed carrier taping and compatibility with automatic mounting machines streamline high‑volume SMT production.
• Controlled leakage and ripple handling: Specified leakage current (≤ 10 µA) and ripple current ratings at 120 Hz and 10 kHz help designers validate power and signal integrity in their circuits.
• Regulatory compliance: RoHS compliance supports regulatory needs for environmental directives.

Why Choose UWP1HR33MCL1GB?

UWP1HR33MCL1GB is positioned for engineers seeking a compact, bi‑polar aluminum electrolytic capacitor with automotive qualification and assembly‑friendly packaging. Its combination of 50 V rating, 0.33 µF capacitance, controlled leakage, and endurance at elevated temperature makes it a fit for board‑level designs where space, reliability, and automated manufacturing are important.

Manufactured by Nichicon and offered in mass production packaging, this part delivers specification continuity and supply readiness for design and production programs that demand proven materials and documented series characteristics.

Request a quote or contact sales to discuss availability, volume pricing, and integration details for UWP1HR33MCL1GB.