UWP1HR22MCL1GB
| Part Description |
0.22 µF 50 V ±20% Bi-Polar Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 613 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UWP |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 220 nF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 5.5 mm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 1000 h @ 85°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -40°C - 85°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Bi-Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 3 mA @ 10 kHz | Ripple Current Low Frequency | 2 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.4 x 4 mm | Surface Mount Land Size | 4.3 x 4.3 mm | ||
| Tolerance | -20%~20% | Voltage | 50 V |
Overview of UWP1HR22MCL1GB – Aluminum Electrolytic Chip Capacitor, Bi‑Polar, 50 V, 0.22 µF
The UWP1HR22MCL1GB is a bi‑polar aluminum electrolytic chip capacitor in a surface‑mount form factor. It provides 0.22 µF capacitance at a 50 V rating with a ±20% tolerance, designed for compact, automated PCB assembly.
Targeted for applications requiring automotive‑grade reliability and high‑density PCB mounting, this part combines a small φ4 × 5.4 mm package, embossed carrier taping for automatic placement, and AEC‑Q200 qualification to support demanding production environments.
Key Features
- Capacitance & Voltage — 220 nF (0.22 µF) rated at 50 V with ±20% tolerance for predictable AC and transient behavior.
- Bi‑Polarized Chip Construction — Bipolar design suitable where non‑polar behavior is required in the circuit.
- Compact SMD Package — Chip dimensions φ4 × 5.4 mm (L: 5.4 × D: 4 mm) and surface mount land size 4.3 × 4.3 mm for high‑density PCB layouts.
- Automated Assembly Ready — Supplied in embossed carrier taping compatible with automatic mounting machines for efficient production flow.
- Automotive‑Grade Reliability — AEC‑Q200 qualification and endurance rating of 1000 hours at 85°C (with polarity inversion every 250 hours) ensuring stability under stress conditions.
- Temperature Range — Rated for operation from −40°C to +85°C to cover a wide range of environmental conditions.
- Low Leakage and Ripple Performance — Leakage current specified at 10 µA (or ≤0.05CV) with ripple current ratings of 2 mA at 120 Hz and 3 mA at 10 kHz for low‑noise applications.
- RoHS Compliant — Meets RoHS directive requirements.
Typical Applications
- Automotive Electronics — Suitable for automotive modules where AEC‑Q200 qualification and wide temperature operation are required.
- High‑Density PCB Designs — Chip form factor and compact land pattern make it suitable for space‑constrained circuit layouts on high‑density boards.
- Automated Production Environments — Packaged in embossed carrier taping for compatibility with automatic placement machines and streamlined assembly.
Unique Advantages
- AEC‑Q200 Qualification: Provides documented automotive‑grade reliability for designs that require industry qualification.
- Small, Mounting‑Friendly Package: φ4 × 5.4 mm chip size and specified land pattern simplify integration into compact PCBs.
- Ready for Automated Assembly: Embossed carrier taping supports pick‑and‑place processes and high‑volume manufacturing.
- Robust Endurance: Endurance tested to 1000 hours at 85°C with defined post‑test limits for capacitance, tan δ and leakage.
- Low Leakage & Defined Ripple Ratings: Leakage current specified and ripple current data at 120 Hz and 10 kHz enable reliable power‑filtering design choices.
- Wide Operating Temperature: −40°C to +85°C rating supports a broad range of operating environments.
Why Choose UWP1HR22MCL1GB?
UWP1HR22MCL1GB positions itself as a compact, automotive‑grade chip capacitor that balances size, reliability, and assembly compatibility. With AEC‑Q200 qualification, defined endurance performance, and embossed carrier taping for automated placement, it is suited to production programs that demand documented reliability and efficient manufacturing.
This part is ideal for engineers and buyers designing space‑constrained boards in automotive and other demanding applications where a bi‑polar electrolytic capacitor with controlled leakage, defined ripple characteristics, and a wide operating temperature range is required.
Request a quote or submit a pricing inquiry to discuss availability, lead times, and volume options with our sales team.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016