UWP1V2R2MCL1GB

The UWP1V2R2MCL1GB is a surface‑mount, bi‑polarized aluminum electrolytic capacitor in a compact φ4 × 5.4 mm can‑type chip package. It delivers 2.2 µF capacitance at a 35 V rating with ±20% tolerance and is designed for automated placement on high‑density PCBs.

With AEC‑Q200 qualification, RoHS compliance and a 1000‑hour endurance rating at 85 °C, this part targets automotive and other demanding applications that require stable bipolar capacitance, low leakage and support for automated assembly processes.

Key Features

• Capacitance & Voltage — 2.2 µF rated capacitance at 35 V with ±20% tolerance (measured at 120 Hz, 20 °C).
• Bi‑Polar Construction — Bipolarized design suitable where polarity reversal may occur during operation and testing.
• Low Leakage — Leakage current specified at 10 µA (after 2 minutes' application of rated voltage at 20 °C), supporting low‑current designs.
• Loss Tangent — tan δ of 0.15 (max.) at 35 V, measured at 120 Hz and 20 °C for predictable AC performance.
• Ripple Current Capability — Specified ripple current of 8.4 mA at 120 Hz and 12.6 mA at 10 kHz to support AC workloads within its ratings.
• Endurance — Rated for 1000 hours at 85 °C (with polarity inversion every 250 hours) and meeting the specified limits for capacitance, tan δ and leakage after recovery to 20 °C.
• Surface‑Mount Chip Package — φ4 × 5.4 mm radial can (SMD) designed for high‑density PCB mounting; supplied in embossed carrier tape for automatic placement.
• Environmental & Quality — RoHS compliant and AEC‑Q200 qualified.

Typical Applications

• Automotive electronic modules — AEC‑Q200 qualification makes this capacitor suitable for automotive assemblies requiring surface‑mount placement and bipolar operation.
• High‑density PCB assemblies — Chip‑type radial can package and embossed carrier taping support automated mounting on compact boards.
• Automated production lines — Designed for use with automatic mounting machines fed with carrier tape to streamline high‑volume manufacturing.

Unique Advantages

• Bipolar stability: Bi‑polarized construction enables use where polarity reversal can occur, reducing the need for circuit workarounds.
• Compact SMD can: φ4 × 5.4 mm chip package saves board area while remaining compatible with automatic placement processes.
• Automated assembly ready: Embossed carrier taping and surface‑mount format support pick‑and‑place workflows for mass production.
• Long endurance at elevated temperature: 1000 hours at 85 °C with polarity inversion cycling provides a defined reliability profile for qualification and design planning.
• Measured AC performance: Specified tan δ and frequency‑rated ripple currents give predictable behavior at 120 Hz and higher frequencies.
• Industry quality and compliance: AEC‑Q200 qualification and RoHS compliance help meet regulatory and quality requirements for production designs.

Why Choose UWP1V2R2MCL1GB?

The UWP1V2R2MCL1GB combines compact, surface‑mount packaging with bi‑polarized aluminum electrolytic construction to address applications that require reliable bipolar capacitance, low leakage and automated assembly compatibility. Its defined ripple current ratings, measured tan δ and 1000‑hour endurance at 85 °C give designers quantifiable performance targets for qualification and system validation.

This part is well suited to engineers and procurement teams designing automotive and high‑density electronic assemblies who need an SMD bipolar capacitor with AEC‑Q200 qualification, RoHS compliance and production‑ready packaging.

Request a quote or submit an inquiry to receive pricing, availability and lead‑time information for UWP1V2R2MCL1GB. Our team will respond with the details you need to move your design into production.