UWP1V4R7MCL1GB

The UWP1V4R7MCL1GB is a chip-type, bi-polar aluminum electrolytic capacitor in a surface-mount package designed for high-density PC boards. It provides a nominal capacitance of 4.7 µF at a rated voltage of 35 V and is intended for applications that require AEC-Q200 qualification and RoHS compliance.

Its compact footprint and carrier-tape compatibility support automated assembly workflows, while specified environmental and endurance characteristics address demanding operating conditions typical in automotive electronics and other embedded systems.

Key Features

• Electrical Characteristics — Nominal capacitance 4.7 µF with a rated voltage of 35 V and capacitance tolerance of ±20% (–20% to 20%).
• Bi-Polar Construction — Bi-polarized capacitor topology suited to circuit designs that require non-polar or polarity-independent components.
• Package & Mounting — Chip-type, surface-mount radial can (SMD) package sized L: 5.4 × D: 5 mm with recommended land size L: 5.3 × W: 5.3 mm; compatible with automatic mounting machines fed by carrier tape.
• Temperature & Endurance — Rated for an operating temperature range of –40°C to +85°C with an endurance specification of 1000 hours at 85°C (with polarity inversion every 250 hours as defined in the series endurance test).
• Ripple Current & Frequency — Specified ripple current values: 18 mA at 120 Hz and 27 mA at 10 kHz. Frequency coefficients for ripple current are provided in the series documentation for other frequencies.
• Qualification & Compliance — AEC-Q200 qualified and compliant to the RoHS directive (2011/65/EU, (EU)2015/863).
• Soldering & Shelf Life Characteristics — Meets resistance-to-soldering-heat criteria and shelf-life recovery procedures per the series datasheet (storage and voltage treatment conditions specified in documentation).

Typical Applications

• Automotive electronics — AEC-Q200 qualification and specified endurance make the part suitable for use in automotive electronic modules where a compact bi-polar SMD capacitor is required.
• High-density PC boards — Chip-type SMD form factor enables placement in tightly packed, space-constrained board layouts.
• Automated assembly lines — Carrier-tape compatibility and surface-mount packaging support automated pick-and-place assembly processes.

Unique Advantages

• AEC-Q200 qualification: Provides component-level qualification for designs that require industry-recognized stress screening.
• Compact chip SMD format: Small L: 5.4 × D: 5 mm footprint helps save board area in dense layouts.
• Bi-polar construction: Removes polarity constraints inherent to polarized electrolytics, enabling use in bipolar or AC-coupled circuits.
• Automated assembly ready: Designed for carrier-tape feeding and surface-mount pick-and-place processes to streamline manufacturing.
• Documented endurance and thermal specs: 1000 hours at 85°C endurance plus defined resistance-to-soldering-heat and shelf-life procedures for predictable long-term performance.
• RoHS compliant: Conforms to applicable RoHS directives for restricted substances.

Why Choose UWP1V4R7MCL1GB?

The UWP1V4R7MCL1GB combines a compact chip SMD package with bi-polar aluminum electrolytic construction and AEC-Q200 qualification, delivering a component tailored to high-density, reliability-focused designs. With defined ripple current ratings, a broad operating temperature range (–40°C to +85°C), and documented endurance, it fits designs where measured performance and manufacturability are priorities.

This part is suited for engineers specifying small-footprint, automated-assembly-capable capacitors for automotive electronics and embedded systems that require traceable qualification and RoHS compliance, backed by series-level datasheet guidance on frequency coefficients, endurance, and soldering/shelf-life procedures.

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