UWP1V3R3MCL1GB

The UWP1V3R3MCL1GB is an aluminum electrolytic, chip-type capacitor from Nichicon's UWP series. It is a bi-polarized, surface-mount device designed for high-density PC boards and compatible with automated mounting using carrier tape.

Built to industry-focused reliability standards, this part is AEC‑Q200 qualified and RoHS compliant. Key electrical characteristics include 3.3 µF capacitance at a 35 V rating, a compact package footprint, and ripple current specifications suited to demanding embedded applications.

Key Features

• Electrical Performance: Rated capacitance 3.3 µF with a rated voltage of 35 V and tolerance of ±20% (−20% to 20%). Leakage current specification follows the series guidance (≤0.05CV or 10 µA after 2 minutes, whichever is greater).
• Bi‑Polarized Design: Bi‑polar construction and endurance testing with polarity inversion (1000 hours at 85°C with polarity inverted every 250 hours) supports applications where polarity reversal may occur.
• Ripple Current Capability: Low-frequency ripple current of 16 mA at 120 Hz and high-frequency ripple current of 24 mA at 10 kHz, with frequency coefficients available in the series data.
• Compact SMD Package: Chip-type surface-mount package with dimensions L: 5.4 × D: 5 mm and a recommended land size of 5.3 × 5.3 mm; package case listed as Radial, Can - SMD.
• Automated Assembly Friendly: Designed for surface mounting on high-density PCBs and applicable to automatic mounting machines fed with carrier tape.
• Operational Range & Reliability: Rated for operation from −40°C to +85°C with a specified lifetime of 1000 hours at 85°C per series endurance data; meeting soldering heat resistance and shelf-life conditions per the series specifications.
• Compliance & Qualification: AEC‑Q200 qualified for automotive-grade reliability and compliant with the RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics: Suitable for automotive electronic modules where AEC‑Q200 qualification and compact SMD capacitors are required.
• High‑Density PCBs: Power decoupling and local filtering on space-constrained boards, leveraging the chip package and small land pattern.
• Automated Assembly Lines: Designed for automatic placement with carrier tape support, easing high-volume production and pick-and-place processes.

Unique Advantages

• AEC‑Q200 Qualification: Provides a level of automotive-grade reliability that supports use in applications with demanding environmental requirements.
• Compact Footprint: Small chip-type package and tight land pattern help conserve board area on high-density layouts.
• Bi‑Polar Endurance: Endurance testing with polarity inversion demonstrates capability for circuits where polarity can change, reducing design constraints.
• Clear Ripple Specifications: Specified ripple current values at 120 Hz and 10 kHz allow predictable thermal and performance planning in power designs.
• RoHS Compliant: Meets environmental compliance requirements for global production and procurement.
• Assembly‑Ready: Compatible with automated mounting via carrier tape, simplifying integration into high-volume manufacturing flows.

Why Choose UWP1V3R3MCL1GB?

The UWP1V3R3MCL1GB combines a compact SMD chip package with electrical characteristics tailored for demanding, space-constrained designs. Its bi-polarized construction, defined ripple ratings, and 3.3 µF/35 V specification make it a practical choice for engineers needing a reliable electrolytic capacitor in a small footprint.

With AEC‑Q200 qualification, RoHS compliance, and design support for automated assembly, this Nichicon capacitor is positioned for applications that require consistent performance, manufacturability, and qualification-grade reliability.

Request a quote or submit a procurement inquiry for UWP1V3R3MCL1GB to receive pricing and availability information tailored to your project needs.