UWT1H2R2MCL1GB

The UWT1H2R2MCL1GB is a chip-type aluminum electrolytic capacitor in a compact SMD can designed for surface mounting on high-density printed circuit boards. It provides 2.2 µF capacitance at a 50 V rating with a wide operating temperature range of −55 °C to 105 °C and is AEC-Q200 qualified for automotive applications.

This part is tape-feed compatible for automated placement and is RoHS compliant, making it suitable for production environments that require reliability across temperature extremes and automated assembly.

Key Features

• Electrical Characteristics — 2.2 µF capacitance at 50 V with ±20% tolerance and polarized construction for DC filtering and decoupling applications.
• Wide Temperature Range — Rated to operate from −55 °C to 105 °C, supporting designs that encounter extreme ambient conditions.
• AEC-Q200 Qualification — Meets AEC-Q200 qualification requirements, enabling use in many automotive electronic designs.
• Endurance and Reliability — Specified lifetime of 1000 hours at 105 °C; after endurance testing capacitance change remains within ±20% (for 25 V or more), with leakage current and tan δ maintained within specified limits.
• Low Leakage and Loss — Leakage current after 2 minutes at 20 °C is ≤ 0.01CV or 3 µA (whichever is greater); tan δ for 50 V parts is specified with a maximum of 0.14.
• Ripple Performance — Ripple current ratings: 11 mA at 120 Hz and 16.5 mA at 10 kHz, useful for low-current decoupling and filtering on power rails.
• Compact SMD Package — Radial, can-style SMD with overall dimensions L: 5.4 × D: 4 mm and recommended land size L: 4.3 × W: 4.3 mm for high-density board layouts.
• Manufacturing and Assembly — Designed for surface mounting and compatible with automatic mounting machines fed by carrier tape, simplifying automated PCB assembly.

Typical Applications

• Automotive Electronic Control Units (ECUs) — Suitable for power decoupling and filtering in automotive modules where AEC-Q200 qualification and wide temperature capability are required.
• Power Rail Decoupling on High‑Density PCBs — Compact chip form factor and low-profile package make this part appropriate for space-constrained surface-mount power networks.
• Automated Production Lines — Tape-feed compatibility and SMD packaging streamline placement in high-volume automated assembly processes.

Unique Advantages

• AEC-Q200 Qualified: Provides an established qualification route for automotive use cases that demand component-level reliability.
• Wide Operating Temperature: −55 °C to 105 °C rating enables deployment in environments with extreme thermal variation.
• Compact, Low-Profile SMD Can: Small footprint (5.4 × 4 mm) and recommended land size optimize board real estate on high-density designs.
• Designed for Automated Assembly: Carrier-tape compatibility reduces assembly time and supports consistent placement in volume manufacturing.
• High-Temperature Endurance: 1000-hour rating at 105 °C with defined limits on capacitance change, tan δ, and leakage current supports long-term stability under thermal stress.
• Verified Leakage and Loss Limits: Clear leakage current and tan δ specifications for the 50 V rating allow predictable behavior in low-current filtering applications.

Why Choose UWT1H2R2MCL1GB?

UWT1H2R2MCL1GB positions itself as a compact, automotive-grade aluminum electrolytic capacitor for designs that require wide temperature tolerance, tape-feed assembly compatibility, and defined endurance at elevated temperatures. Its 2.2 µF/50 V rating, controlled leakage and tan δ, and ripple current specifications make it suitable for power decoupling and filtering on high-density boards.

This part is targeted at engineers and procurement teams building automotive and other temperature-sensitive surface-mount electronics who need a qualified, compact electrolytic solution with documented endurance and assembly-friendly packaging.

Request a quote or contact sales to discuss availability, lead times, and technical details for integrating UWT1H2R2MCL1GB into your design.