UWT1H470MCL1GS
| Part Description |
47 µF 50 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,466 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UWT |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 47 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 8 mm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 1000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 94.5 mA @ 10 kHz | Ripple Current Low Frequency | 63 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 7.7 x 6.3 mm | Surface Mount Land Size | 6.6 x 6.6 mm | ||
| Tolerance | -20%~20% | Voltage | 50 V |
Overview of UWT1H470MCL1GS – Chip Type Aluminum Electrolytic Capacitor (47 µF, 50 V)
The UWT1H470MCL1GS is a chip-type aluminum electrolytic capacitor in Nichicon's UWT series, engineered for surface-mount assembly on high-density PC boards. Its core characteristics—47 µF capacitance, 50 V rated voltage and polarized construction—target power filtering and decoupling in demanding environments.
Designed for automotive applications and AEC-Q200 qualification, this RoHS-compliant capacitor offers a wide operating temperature range (−55 °C to +105 °C) and is compatible with automatic placement via carrier tape, supporting efficient manufacturing and robust field performance.
Key Features
- Capacitance & Voltage — 47 µF nominal capacitance with a 50 V rated voltage and ±20% tolerance, suitable for bulk decoupling and local energy storage.
- Wide Temperature Range — Rated to operate from −55 °C to +105 °C, enabling use across extreme ambient and under-hood conditions.
- AEC-Q200 Qualified — Series qualification for automotive-grade reliability; appropriate for designs requiring AEC-Q200-rated parts.
- Surface-Mount Chip Can — Radial can SMD package designed for placement on high-density PCBs and compatible with automatic mounting machines fed by carrier tape.
- Endurance — Qualified for 1000 hours at 105 °C under rated voltage, with defined limits for capacitance change, tan δ and leakage current after endurance testing.
- Ripple Current — Specified ripple current performance of 63 mA at 120 Hz and 94.5 mA at 10 kHz for thermal and ripple handling considerations in power circuits.
- Compact Footprint — Small package dimensions (7.7 mm length × 6.3 mm diameter) with recommended land size of 6.6 mm × 6.6 mm to support high-density layouts.
- Environmental Compliance — RoHS compliant (2011/65/EU,(EU)2015/863), aligning with regulated material requirements.
Typical Applications
- Automotive power modules — Bulk decoupling and local energy storage for control units and power distribution modules, benefitting from the wide temperature range and AEC-Q200 qualification.
- ECU and control electronics — Power-supply filtering and smoothing in engine, transmission and body control electronics where durability and temperature tolerance are required.
- Sensors and actuator interfaces — Voltage stabilization and transient absorption for sensor front-ends and actuator drivers in harsh environments.
Unique Advantages
- Automotive-grade reliability: AEC-Q200 qualification and defined 1000-hour endurance at 105 °C support use in automotive electronics and other high-reliability systems.
- Wide operating temperature: −55 °C to +105 °C capability ensures stable performance across extreme thermal conditions encountered in vehicle and industrial environments.
- Manufacturing-ready package: SMD radial can designed for carrier-tape feeding and automatic placement, simplifying assembly on high-density PCBs.
- Compact energy density: 47 µF at 50 V in a 7.7 × 6.3 mm package reduces board space for power decoupling and bulk filtering functions.
- Measured ripple handling: Specified ripple currents at 120 Hz and 10 kHz allow designers to evaluate thermal and ripple performance for their power circuits.
- Regulatory compliance: RoHS conformity ensures material compliance for regulated markets and procurement.
Why Choose UWT1H470MCL1GS?
The UWT1H470MCL1GS combines compact SMD packaging with a wide temperature range and automotive-grade qualification, making it well suited to power filtering and decoupling tasks in demanding embedded and vehicle electronics. Its carrier-tape compatibility and defined endurance and ripple specifications help streamline production validation and field reliability assessments.
This part is ideal for engineers designing compact, robust power subsystems that require a proven electrolytic solution with clear electrical and environmental specifications, long-term stability at elevated temperatures, and compatibility with automated assembly processes.
Request a quote or submit an inquiry to receive pricing and availability for UWT1H470MCL1GS and to discuss lead times and sample availability for your project.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016