UWT1H3R3MCL1GB

CAP ALUM 3.3UF ±20% 50V SMD
Part Description

3.3 µF 50 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 1,236 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUWT
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotiveCapacitance3.3 µFECCNEAR99
ESRN/AHeight Seated (Max)5.5 mmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp1000 h @ 105°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-55°C - 105°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency21 mA @ 10 kHzRipple Current Low Frequency14 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension5.4 x 4 mmSurface Mount Land Size4.3 x 4.3 mm
Tolerance-20%~20%Voltage50 V

Overview of UWT1H3R3MCL1GB – Aluminum Electrolytic Chip Capacitor, 3.3 µF, 50 V

The UWT1H3R3MCL1GB is a Nichicon UWT series aluminum electrolytic chip capacitor in a compact surface-mount can package. It provides 3.3 µF capacitance at a 50 V rating and is designed for automated SMT assembly on high-density printed circuit boards.

Engineered for demanding temperature environments, this chip-type capacitor operates from −55 °C to +105 °C, carries AEC-Q200 qualification, and is RoHS compliant — making it suitable for automotive electronic applications that require wide temperature tolerance and reliability.

Key Features

  • Capacitance & Voltage — 3.3 µF nominal capacitance with a 50 V rated voltage and ±20% tolerance (120 Hz, 20 °C).
  • Wide Temperature Range — Rated for operation from −55 °C to +105 °C to support applications with broad thermal requirements.
  • AEC-Q200 Qualified — Series-level qualification noted in the product data for automotive-grade reliability.
  • Endurance — Rated for 1000 hours at 105 °C with specified limits on capacitance change (within ±20% for 25 V and above) and leakage current remaining at or below initial specified values after the test.
  • Low Ripple Current — Specified ripple current of 14 mA at 120 Hz and 21 mA at 10 kHz for decoupling and filtering stability at low amplitudes and higher frequencies.
  • Chip SMD Can Package — Compact dimensions L: 5.4 × D: 4.0 mm with surface-mount land footprint of 4.3 × 4.3 mm; designed for high-density PCB mounting and carrier-tape automated placement.
  • Leakage Current Specification — Series-level leakage current limit after 2 minutes at 20 °C: not more than 0.01CV or 3 µA, whichever is greater.
  • RoHS Compliant — Conforms to RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

  • Automotive electronic modules — SMD chip capacitor suitable for use in modules where AEC-Q200 qualification and −55 °C to +105 °C operation are required.
  • Automotive power rails — 3.3 µF at 50 V with specified ripple current values makes the part suitable for local decoupling and smoothing on automotive power lines.
  • Automated high-density PCB assembly — Designed for carrier-tape feeding and surface mounting on compact boards for space-constrained automotive electronics.

Unique Advantages

  • Wide operating temperature capability: Supports −55 °C to +105 °C for designs exposed to automotive temperature extremes.
  • AEC-Q200 qualification: Series-level automotive qualification supports integration into automotive-grade systems where component-level qualification is required.
  • Compact SMD can footprint: Small L: 5.4 × D: 4.0 mm size and 4.3 × 4.3 mm land pattern help reduce PCB area while enabling automatic placement.
  • Proven endurance at elevated temperature: 1000 hours at 105 °C with controlled limits on capacitance change and leakage current for predictable long-term behavior.
  • Low leakage and specified ripple behavior: Leakage current limit and ripple current specifications provide predictable performance for low-amplitude filtering and decoupling tasks.
  • RoHS compliance and automated assembly compatibility: Meets RoHS requirements and is designed for carrier-tape automated mounting to simplify supply-chain and production processes.

Why Choose UWT1H3R3MCL1GB?

The UWT1H3R3MCL1GB combines a compact SMD can package with a 3.3 µF/50 V electrical profile and wide −55 °C to +105 °C operating range, making it a practical choice for automotive electronic modules and other temperature-challenging assemblies. AEC-Q200 qualification and 1000-hour endurance at 105 °C provide measured reliability characteristics designers can reference in robust system designs.

Its carrier-tape compatibility and small land footprint support automated high-density PCB assembly, while specified leakage and ripple current figures enable predictable decoupling and smoothing in power rail applications. Choose this part when you need a verified, surface-mount aluminum electrolytic capacitor that aligns with automotive-grade requirements and compact PCB layouts.

If you would like pricing, availability, or part-specific support, please request a quote or contact sales to discuss your requirements and obtain a formal quotation.

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    Date Founded: 1950


    Headquarters: Nakagyo, Kyoto, Japan


    Employees: 5,000+


    Revenue: $1.2 Billion


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